Packaging Engineer at Advanced Micro Devices, Inc

Hsinchu City, Taiwan, Taiwan -

Full Time

Start Date

Immediate

Expiry Date

07 Apr, 26

Salary

0.0

Posted On

07 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Supplier Engagement, Project Management, Conflict Management, Interpersonal Skills, Executive Presentation, Communication Skills, Leadership, Flip Chip Packaging, Semiconductor Manufacturing, Value Engineering, Change Management, Market Intelligence Analysis, Team Leadership, Failure Analysis, Package Reliability, ESD Standards, Automotive Standards

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are looking for a candidate that can drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology. THE PERSON: The successful candidate must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder. KEY RESPONSIBILITIES: Drive for supplier engagement on continuous improvement and new capabilities ahead of need Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders Drive external manufacturer on issue resolution and issue prevention. Lead, plan and execute change management from internal or external parties Involved in regional supplier management – drive to meet Key Performance Indices Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio Prepare & present Executive Summary of projects and supplier’s performance Coordination of activities within/external team to deliver critical metrics Overseas travelling as required PREFERRED EXPERIENCE: Strong knowledge in Flip Chip Packaging (while operational experience in bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage) Track record of development work leading to volume production in Semiconductor manufacturing Good leadership and interpersonal skills Team Leadership Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive) ACADEMIC CREDENTIALS: Bachelor/MS degree in Mechanical or Material or Chemical Engineering Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

Responsibilities

The role involves driving supplier engagement for continuous improvement and new capabilities, as well as planning and executing New Product Introduction activities. The candidate will also lead issue resolution with external manufacturers and coordinate activities to meet key performance indices.