Packaging Engineer I Semiconductors
at
CAPGEMINI ENGINEERING
Diegem, , Belgium
-
Full Time
Start Date
Immediate
Expiry Date
03 Oct, 25
Salary
0.0
Posted On
04 Jul, 25
Experience
0 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Cloud, Technology, It, Strategy, Design
Industry
Electrical/Electronic Manufacturing
Description
Responsibilities
Define the package type in collaboration with customers and sub-contractors.
Provide technical support and act as an intermediary between customers and sub-contractors to address and resolve packaging-related issues.
Lead the development of modules, MCM (Multi-Chip Modules), and substrates for new types of packages in partnership with our sub-contractors.
Coordinate package design, as well as electrical and thermal characterization and manufacturability assessments.
Ensure that the package development process, from conceptual design and feasibility studies to substrate fabrication, is completed on time and meets cost and quality requirements (signal integrity, thermal performance, manufacturability, bondability, DfX, etc.).
Discuss potential yield and/or reliability issues, conduct failure analysis, and drive process improvements to enhance packaging operations.
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