Packaging Engineering Manager at Texas Instruments

, Oita Prefecture, Japan -

Full Time

Start Date

Immediate

Expiry Date

31 Aug, 26

Salary

0.0

Posted On

02 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

High Voltage Packaging, Power Module Design, GaN, SiC, IGBT, CFD, Thermomechanical Analysis, Electrical Parasitic Extraction, People Management, Reliability Planning, Process Flow Development, Subcontractor Management, Material Science, Assembly Flow Integration, English Proficiency, Japanese Proficiency

Industry

Semiconductor Manufacturing

Description

Change the world. Love your job. The Emerging Packaging and Test Team at Texas Instruments is looking for a qualified candidate * To lead a high-performing team of packaging technologists to define, design, develop and scale to volume production high voltage (200-3300V) packages and high power modules for the Industrial, Automotive, Renewable and Telecom markets. * The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps * The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools. * The candidate will identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds. The candidate must also be capable of developing new process flows/technologies necessary for scaling to high volume manufacturing * The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues. * The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps * The candidate must be a proven leader and people manager, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products. Why TI? * Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. * We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI [https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012] * Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com [https://www.ti.com/]. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

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Responsibilities

Lead a team of packaging technologists to design and scale high voltage packages and power modules for industrial, automotive, and telecom markets. Define forward-looking roadmaps and manage the transition from prototype to high-volume manufacturing.