Start Date
Immediate
Expiry Date
15 Apr, 26
Salary
0.0
Posted On
15 Jan, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
PVD, Metal Deposition, Semiconductor Packaging, Heterogeneous Integration, Bump, Fan-out, TSV, Hybrid Bonding, Statistical Techniques, Troubleshooting, Customer Satisfaction, Technology Development, Process Improvement, Technical Presentations, Strategic Partnerships, Root Cause Analysis
Industry
Semiconductor Manufacturing
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