Packaging Substrate Engineer
at Apple
Santa Clara, California, USA -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 08 Jul, 2024 | USD 300200 Annual | 08 Apr, 2024 | 10 year(s) or above | Project Management Skills,Manufacturing,Process Integration | No | No |
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Description:
SUMMARY
Posted: Mar 6, 2024
Role Number:200449892
Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there’s no telling what you could accomplish.
KEY QUALIFICATIONS
- We are looking for an individual with experience as a process integration, manufacturing, R&D engineer in substrate industry In-depth knowledge of substrate technology
- Familiarity with PKG process & criteria is a plus
- Outstanding technology development & project management skills
- Strong communication & collaborative skills
- BS and +10 years of relevant industry experience
DESCRIPTION
- Responsible for substrate technology path finding and roadmap execution. - Direct work with vendors for new package development and qualification. - Drive vendors to meet requirement & timeline. - You will work across variety of functional groups directly & involve in engineering, product development.
EDUCATION & EXPERIENCE
- BS and +10 years of relevant industry experience
Responsibilities:
Please refer the Job description for details
REQUIREMENT SUMMARY
Min:10.0Max:15.0 year(s)
Information Technology/IT
IT Software - Other
Software Engineering
BSc
Proficient
1
Santa Clara, CA, USA