PCB Layout Engineer at Schneider Electric Industries Malaysia

Shanghai, Shanghai, China -

Full Time

Start Date

Immediate

Expiry Date

30 Aug, 26

Salary

0.0

Posted On

01 Jun, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

PCB Layout, Cadence Allegro, Power Electronics Design, EMC Design, Signal Integrity, Power Integrity, Thermal Management, IPC Standards, SMT Assembly, Multi-layer Board Routing, Schematic Interpretation, Footprint Library Creation

Industry

Automation Machinery Manufacturing

Description

职位概述我们正在寻找一位注重细节、经验丰富的PCB Layout工程师，加入我们的电力电子研发团队。您将专注新型配电产品中各类电力电子产品的PCB（包括控制板、电源板及大功率功率板）物理设计。您是实现产品高性能、高可靠性和可制造性的关键一环，直接影响到产品的电气性能、散热与EMC表现。主要职责 --PCB物理设计：根据硬件工程师提供的设计规范，独立完成多层板的布局布线工作。负责包括控制板（高速数字/模拟信号）、电源板（中等功率）及功率板（高电压、大电流）在内的所有类型PCB设计。 --协同设计与规则制定：与硬件工程师紧密合作，理解和消化需求，共同制定详细的PCB布局布线约束规则。针对安规、信号完整性、电源完整性和热管理要求，提供最优的布局方案和布线策略。 --电力电子专项设计：功率回路设计：优化高电压、大电流路径的布局，最小化寄生电感和回路面积。 --EMC与安规设计：在布局中严格保证电气间隙与爬电距离，通过优化地平面、屏蔽和滤波器布局来提升EMC性能。 --热设计：为功率器件和发热元件设计有效的散热路径，包括热焊盘、过孔阵列及与散热器的接口配合。 --信号完整性：确保关键敏感信号（如采样、驱动信号）的完整性，避免干扰。 --设计输出与文档：生成所有必要的生产文件（Gerber、钻孔文件、装配图、钢网文件等）。创建并维护元器件封装库，确保其准确性和可制造性。编写Layout设计说明文档。 --设计验证与支持：参与PCB设计评审，支持SI/PI/热仿真工程师完成前期仿真。协助解决试产、量产及测试中遇到的PCB相关技术问题。 Position Overview We are seeking a detail-oriented and experienced PCB Layout Engineer to join our power electronics R&D team. You will focus on the physical design of PCBs (including control boards, power supply boards, and high-power boards) for various power electronic products in new power distribution systems. You will be a critical link in achieving high performance, reliability, and manufacturability, directly impacting the product's electrical performance, thermal management, and EMC performance. Key Responsibilities PCB Physical Design: Independently complete the layout and routing of multi-layer boards based on design specifications provided by hardware engineers. Responsible for designing all types of PCBs, including control boards (high-speed digital/analog signals), power supply boards (medium power), and high-power boards (high voltage, high current). Collaborative Design & Rule Definition: Work closely with hardware engineers to understand and interpret requirements, and jointly define detailed PCB layout and routing constraint rules. Provide optimal placement and routing strategies considering safety, signal integrity, power integrity, and thermal management requirements. Power Electronics-Specific Design: Power Loop Design: Optimize the layout of high-voltage and high-current paths to minimize parasitic inductance and loop area. EMC & Safety Design: Strictly ensure creepage and clearance distances in the layout; enhance EMC performance by optimizing ground planes, shielding, and filter placement. Thermal Design: Design effective thermal dissipation paths for power devices and heat-generating components, including thermal pads, via arrays, and interface coordination with heat sinks. Signal Integrity: Ensure the integrity of critical sensitive signals (e.g., sampling, gate drive signals) and avoid interference. Design Output & Documentation: Generate all necessary production files (Gerber, drill files, assembly drawings, solder paste stencil files, etc.). Create and maintain component footprint libraries, ensuring their accuracy and manufacturability. Prepare PCB layout design documentation. Design Verification & Support: Participate in PCB design reviews; support SI/PI/thermal simulation engineers in pre-layout and post-layout simulations. Assist in resolving PCB-related technical issues encountered during prototyping, mass production, and testing. 任职要求 --教育背景：专科及以上学历，电子工程、通信工程、自动化或相关专业。工作经验：3年以上高速、高密度或高功率PCB Layout设计经验。有光伏逆变器、储能变流器、UPS、伺服驱动器、大功率电源等电力电子产品设计经验者优先。 --专业技能：设计工具：精通 Cadence Allegro 等主流EDA设计工具。专业知识：深刻理解PCB制造工艺（层压、孔铜、表面处理等）及SMT装配流程。电气知识：熟悉IPC标准，具备基本的电路知识，能够理解原理图。专项能力：对高速数字电路、模拟电路、功率电路和RF电路的布局布线有深入理解，能独立解决相关的SI、PI、EMC、热设计问题。 --核心素质：具备较强的责任心、耐心和严谨细致的工作态度。优秀的沟通能力和团队协作精神，能够高效地与硬件工程师协同工作。具备优秀的问题分析能力和解决能力，能够承受压力。 --优先考虑条件熟悉电力电子产品常见的安规标准（如UL 60950-1, UL 1741）及其对PCB布局的要求。具备完整完成PCB设计项目经历者优先。” Qualifications & Requirements Education: Associate degree or higher in Electronic Engineering, Communication Engineering, Automation, or a related field. Experience: 3+ years of experience in high-speed, high-density, or high-power PCB layout design. Experience with power electronics products such as PV inverters, energy storage converters, UPS, servo drives, and high-power supplies is preferred. Technical Skills: Design Tools: Proficiency in mainstream EDA design tools such as Cadence Allegro. Professional Knowledge: Deep understanding of PCB manufacturing processes (lamination, hole plating, surface finishes, etc.) and SMT assembly processes. Electrical Knowledge: Familiarity with IPC standards; solid fundamental circuit knowledge and the ability to understand schematics. Specialized Skills: In-depth understanding of layout and routing for high-speed digital, analog, power, and RF circuits; ability to independently solve related SI, PI, EMC, and thermal design issues. Personal Attributes: Strong sense of responsibility, patience, and a meticulous, rigorous work attitude. Excellent communication skills and teamwork spirit, enabling effective collaboration with hardware engineers. Strong problem-analysis and problem-solving abilities, with the capacity to work under pressure. Preferred Qualifications Familiarity with common safety standards for power electronics products (e.g., UL 60950-1, UL 1741) and their requirements for PCB layout. Priority given to candidates with experience seeing PCB design projects through their complete lifecycle.

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Responsibilities

Responsible for the physical design and routing of multi-layer PCBs for power electronics, including control, power supply, and high-power boards. Collaborates with hardware engineers to optimize electrical performance, thermal dissipation, and EMC compliance.