JOB DESCRIPTION

We invite applications for a fully funded PhD position in Electronic Packaging. This project aims to address critical challenges in miniaturization, designing, thermal management, and reliability of electronic systems for high-performance applications. The research will focus on developing innovative packaging materials, designs, and processes to enable next-generation electronic pacakges and moudules.

JOB REQUIREMENTS

• Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Computer Engineering, or related fields.
• Strong background in data analytics, electronics, thermal analysis, or material characterization.
• Knowledge of packaging processes is a plus.
• Excellent communication skills and proficiency in English (written/oral).
• Ability to work independently and in interdisciplinary teams.

Please refer the Job description for details