Physical IC Design Engineer – Espoo at Bosch Group

Espoo, Uusimaa, Finland -

Full Time

Start Date

Immediate

Expiry Date

01 Feb, 26

Salary

0.0

Posted On

03 Nov, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Physical Design, Digital Subsystems, Mixed-Signal ASICs, System-on-chip ASICs, Place and Route, Clock Tree Synthesis, STA Flow, Low Power Design Techniques, Logic Backend Tools, Timing Analysis, Near-threshold Design, Advanced Hold Fixing Techniques

Industry

Software Development

Description

Company Description About Bosch Sensortec Bosch Sensortec is the technology leader in sensing solutions based on microelectromechanical systems (MEMS) and dedicated to the consumer electronics world. We develop and market key technologies for smartphone applications, tablets, hearables, wearables, smartglasses, augmented and virtual reality applications, gaming devices and the Internet of Things. Our sensors improve people’s well-being and lifestyle and enable consumer electronic devices to sense the world around us. MEMS sensors are therefore part of the foundation for a connected world. Our success in MEMS sensors and solutions is built on a remarkable team driven by passion, innovation and flexibility. Bosch Sensortec is a wholly owned subsidiary of Robert Bosch GmbH. Here at Bosch, we are creating the future by inventing technologies and services of high quality that can enrich peoples' lives. Our promise to our employees is solid: we grow together, we enjoy our work, and we inspire each other. Join us and feel the difference! Job Description At our Finland ASIC development center locations at Oulu and Espoo, we develop ASICs for Bosch in consumer and industrial sensing applications. Your responsibility will be the Physical design of the digital subsystem of Mixed-Signal or System-on-chip ASICs for consumer applications. Observe and think ahead: You work in interdisciplinary teams and perform physical design of digital subsystems. Reliable implementation: You help us to ensure the “First Time Right” of our IC Designs by dedicated support of our verification team. Networked communication: You are part of an international and globally distributed team. Think holistically: Join the development until product release, where you support the characterization and validation of our IC Designs after tapeout. Qualifications Personality: High level of enthusiasm, creativity and willingness to work in international and interdisciplinary teams Working Practice: Effective team player with focused and independent working style; Proven industry experience desirable Experience: Deep knowledge and expertise in Place and Route, clock tree synthesis, STA flow and low power design techniques, Experience working with modern ASIC technology. Deep Understanding of logic backend tools (synthesis, timing analysis, P&R); Good understanding of STA with LVF/moments. Near-threshold design experience and experience in advanced hold fixing techniques are desirable Languages: Proficient English language skills Education: Degree (B.Sc./ M.Sc.) of electrical engineering, computer science or equivalent with outstanding results Additional Information We offer: An exciting job at an international company who is working at the forefront of technology. Being a part of the Finnish department, you can become a part of the future! Do you have any questions? Then contact Teemu Sirviö at [email protected]

Responsibilities

You will be responsible for the physical design of the digital subsystem of Mixed-Signal or System-on-chip ASICs for consumer applications. You will work in interdisciplinary teams and support the characterization and validation of IC Designs after tapeout.