Plasma Technology Process Development Engineer at Applied Materials

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

21 Jan, 26

Salary

0.0

Posted On

23 Oct, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Plasma Technology, Process Development, Data Analysis, Process Optimization, Engineering Collaboration, Plasma Physics, Plasma Characterization, Surface Characterization, Hybrid Bonding, Experiment Design, Prototyping, Technical Guidance, Innovative Solutions, CIPs, OES, XPS

Industry

Semiconductor Manufacturing

Description

Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology and process Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces. Analyze data to identify the key and common factor(s) of plasma that contributes to the strongest activation for hybrid bonding. Optimize process and/ or drive CIPs to improve current generation plasma chamber. Identify the most suitable plasma technology and conduct CnF tests to define requirements for next generation chamber. Deep dive with local & global engineering teams to prototype next gen chamber based on defined requirements. Evaluate proto chamber for hybrid bonding process, propose innovative solutions, and drive engineering optimization. Plasma technology & process subject-matter expect to guide account/field teams on tough plasma technical issues in terms of process and physics. Developing a state-of-the-art integrated hybrid bonder and play a part in this historical industrial inflection from micro-bump/TCB to hybrid bonding. Working with subject-matter experts in various areas around the globe on plasma product development. Good understanding of plasma physics and processes is essential. Practical background on any types of plasma technology and its characterization is needed. Familiar with common plasma characterization tools (such as OES, ion sensor, RGA, thickness measurement etc.) and methodology. Knowhow to analyze surface characterization results (XPS, TEM, phase analysis, SIMS, EELS, etc) is a strong plus. Any backgrounds of WoW or CoW bonding is a bonus. Engineering or science university educational background. > 2 years experiences on plasma HW/ process development preferred. 10% travel commitment to the US (California), Taiwan, Korea or Europe

How To Apply:

Incase you would like to apply to this job directly from the source, please click here

Responsibilities

Improve current generation plasma activation technology for hybrid bonding and develop next generation plasma technology. Design and execute experiments to study various types of plasma and their processes to understand their interaction with bonding surfaces.