ABOUT US

Overview
Georgia Tech prides itself on its technological resources, collaborations, high-quality student body, and its commitment to building an outstanding and diverse community of learning, discovery, and creation. We strongly encourage applicants whose values align with our institutional values, as outlined in our Strategic Plan. These values include academic excellence, diversity of thought and experience, inquiry and innovation, collaboration and community, and ethical behavior and stewardship. Georgia Tech has policies to promote a healthy work-life balance and is aware that attracting faculty may require meeting the needs of two careers.
About Georgia Tech
Georgia Tech is a top-ranked public research university situated in the heart of Atlanta, a diverse and vibrant city with numerous economic and cultural strengths. The Institute serves more than 45,000 students through top-ranked undergraduate, graduate, and executive programs in engineering, computing, science, business, design, and liberal arts. Georgia Tech’s faculty attracted more than $1.4 billion in research awards this past year in fields ranging from biomedical technology to artificial intelligence, energy, sustainability, semiconductors, neuroscience, and national security. Georgia Tech ranks among the nation’s top 20 universities for research and development spending and No. 1 among institutions without a medical school.
Georgia Tech’s Mission and Values
Georgia Tech’s mission is to develop leaders who advance technology and improve the human condition. The Institute has nine key values that are foundational to everything we do:
Students are our top priority.
We strive for excellence.
We thrive on diversity.
We celebrate collaboration.
We champion innovation.
We safeguard freedom of inquiry and expression.
We nurture the wellbeing of our community.
We act ethically.
We are responsible stewards.
Over the next decade, Georgia Tech will become an example of inclusive innovation, a leading technological research university of unmatched scale, relentlessly committed to serving the public good; breaking new ground in addressing the biggest local, national, and global challenges and opportunities of our time; making technology broadly accessible; and developing exceptional, principled leaders from all backgrounds ready to produce novel ideas and create solutions with real human impact.
About the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology
The Woodruff School graduates high caliber mechanical engineers for a demanding profession. Mechanical engineers are the foundation of today’s technological world. To do so, we provide enhanced facilities and laboratories to create the best learning environment and we attract outstanding faculty and students. In this period of rapid technological change, the Woodruff School produces mechanical engineers who are vital to our future. With approximately 3,000 students,100 faculty members, and 70 staff members, we are one of the largest mechanical engineering programs in the country. We are consistently ranked as one of the top 10 mechanical engineering programs in the U.S. at both the graduate and undergraduate levels and continuously innovate to keep our school at the forefront of engineering education. Our size and resources allow us to offer a variety of educational and research opportunities that enable us to produce highly sought after engineering professionals.

JOB SUMMARY

Georgia Tech is at the forefront of advancing semiconductor technologies, particularly in the areas of glass-core packaging and 3D heterogeneous integration. As part of our mission, we aim to bridge the gap between academia and industry, driving innovation while fostering the development of the next generation of engineers and scientists. We are currently seeking highly motivated Post-Doctoral Fellows to contribute to groundbreaking research and collaborate with academic institutions, industry partners, and students in these exciting and rapidly evolving fields.
Job Summary:
We are seeking multiple researchers with expertise in two key areas of advanced packaging:
Glass-Core Packaging
3D Heterogeneous Integration
These positions offer a unique opportunity to conduct cutting-edge research, work closely with graduate and undergraduate students, and collaborate with industry and academic partners. The position holders will contribute to advancing technologies that enable next-generation electronics while documenting their research progress and reporting to sponsors.
General Responsibilities (for all technical areas):
Mentoring Students: Collaborate with and mentor graduate and undergraduate students in both research and development activities, enhancing their learning and fostering their growth in advanced packaging technologies.
Industry & Academic Collaboration: Work closely with academic institutions, industry partners, and external collaborators to ensure research is relevant and applicable to real-world applications.
Research Documentation and Reporting: Maintain comprehensive records of research, including experimental data, design changes, and results. Provide clear, concise reports to sponsors and stakeholders according to a strict set of timelines.
Sponsor Reporting: Provide timely and thorough updates to project sponsors, ensuring alignment with contractual expectations and deliverables. This includes presenting to sponsors and technical community on findings.
Cross-Disciplinary Teamwork: Work in close coordination with other researchers, engineers, and external partners to drive innovation and progress in your respective focus areas.
Scholarly Publications: Advance foundational science and publish scholarly articles.

REQUIRED QUALIFICATIONS

A doctoral degree in Engineering or related fields.

PREFERRED QUALIFICATIONS

PhD in Mechanical Engineering or Materials Science and Engineering or a closely related field.

KNOWLEDGE, SKILLS, & ABILITIES

Skills for mentoring students at the undergraduate and graduate level, while also collaborating with academic and industry partners.
Excellent documentation and reporting skills.
Excellent written and verbal communication skills, including the ability to prepare technical reports and presentations

Job Key Technical Responsibilities:
Glass-Core Microstructuring: Develop and implement new techniques for microstructuring glass cores for advanced packaging applications.
Multilayer High-Density Interconnect Fabrication: Design, fabricate, and characterize high-density interconnects for glass-core packaging.
Thermo-Mechanical Modeling and Experimental Validation: Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures.
Computational Mechanics: Develop multi-scale and multi-physics numerical models consisting of metal, polymer, ceramic, and other electronic packaging materials, and offer insight into interlayer delamination, cracking, and warpage under monotonic and fatigue loading conditions.
Characterization and Reliability Assessment: Characterize materials, interfaces, and samples for thermo-mechanical properties, determine process-induced defects, perform application-relevant reliability experiments, and conduct failure analyses.
Area 2 (multiple openings): 3D Heterogeneous Integration Focus
Job Key Technical Responsibilities:
Compound Semiconductor and Si Stacking, Fabrication, and mechanical Characterization: Design and fabricate TSVs for 3D integration, understand compound semiconductor stacking, and conduct mechanical characterization to validate performance.
Thermo-Mechanical Modeling and Experimental Validation: Develop physics-based thermo-mechanical models, conduct experiments using physical samples and prototypes, enhance fabrication processes, and predict failures.
Computational Mechanics: Develop multi-scale and multi-physics numerical models consisting of metal, polymer, ceramic, and other electronic packaging materials, and offer insight into interlayer delamination, cracking, and warpage under monotonic and fatigue loading conditions.
Characterization and Reliability Assessment: Characterize materials, interfaces, and samples for thermo-mechanical properties, determine process-induced defects, perform application-relevant reliability experiments, and conduct failure analyses.
Advanced Bonding and Assembly Technologies for 3D Chip Stacks: Develop and apply novel bonding and assembly methods for 3D chip stacking, enhancing performance and reliability.