PREFERRED EXPERIENCE:

• Expertise in SI/PI fundamentals and hands-on experience in modeling complex structures such as packages, PCB boards.
• Experience with PCB, Package and IC level power delivery network analysis and design
• Experience with high-speed digital signaling interfaces such as PCIe, G/LP/DDRx, HBM, DP, HDMI, USB, Ethernet etc.
• Expertise in electrical modeling EDA and AMS tools such as HFSS, SIwave, HSPICE, Spectre, Redhawk
• Knowledge of electromagnetic theory and circuit analysis
• Experience in Python, Matlab or other engineering computing languages
• Ability to effectively communicate ideas and results
• Ability to collaborate and work harmoniously with others
• Ability to work independently

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_

THE ROLE:

The Technology and Engineering Power Integrity team ensures that the electrical performance requirements of the silicon and the cost requirements of the product are met through the integration of silicon, package and platform electrical design.

KEY RESPONSIBILITIES:

• Focus on the electrical design, modeling, simulation and characterization of power delivery networks in AMD products. You will work in close collaboration with AMD coworkers and customers to ensure optimal engineering design decisions and efficient problem solving, including:
• Build system level simulations to ensure packages and PCBs are designed well and meet required PI specifications.
• Review layouts to determine any areas that require additional refinement.
• Extract models for package, PCB and Sockets from vendors, collecting standardized models if available, and running through simulation.
• Opportunities to work on the next generation PI technology development for the fast-growing AI market.