Principal Application Engineer Lead (Semiconductor HW & SW) at Ethernovia

San Jose, California, United States -

Full Time

Start Date

Immediate

Expiry Date

01 Aug, 26

Salary

240000.0

Posted On

03 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Embedded development, Ethernet PHYs, Ethernet switches, PCIe, System integration, Debugging, Automotive systems, Robotics, Sensor fusion, Autonomous systems, AI-driven platforms, Embedded software drivers, IEEE802.1 protocols, TSN protocols, PCB board design, CUDA

Industry

Semiconductor Manufacturing

Description

About Ethernovia, Inc. Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications. Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date: Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital) Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025. March 2026: Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms January 2024: Our CEO Ramin Shirani Named MotorTrend Software-Defined Vehicle Innovator Awards Winner (ethernovia.com) September 2023: Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm - Ethernovia Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news With talented employees on 4 continents, we have filed 50+ patents to date. Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility. Principal Application Engineer Lead (Semiconductor HW & SW) Summary: You will support Ethernovia’s field team and local customers developing next-generation Automotive, Robotics, and Physical AI platforms to help integrate Ethernovia’s high-performance Ethernet solutions into advanced hardware & software systems. This is a Hybrid-based position based in San Jose, CA. Key Responsibilities: Interface between Ethernovia’s field team and engineering teams, you will bring strong technical competence and the ability to communicate effectively across our multinational teams Work closely with field application and business development teams around the world along with internal hardware, software and architecture teams, to support customer designs from early concept and development through validation and production. Hands-on role that requires strong problem-solving skills and the ability to operate across fast-moving technical programs Work directly with customer engineering teams and the field teams on complex system integration challenges involving high-speed networking, sensor connectivity, AI compute platforms and robotics architectures. Day-to-day activities include; Creating design collateral Close collaboration with system and engineering teams Technical customer support and system bring-up Debugging to support integration efforts across Automotive and Robotics applications including sensor fusion and autonomous systems and AI-driven platforms Required Experience & Skills: Semiconductor Industry: 10+ years of embedded development experience with focus on both hardware and software Hands-on design experience with at least one of the following: Ethernet PHYs Ethernet switches PCIe Ability to diagnose and debug problems effectively Excellent team working abilities across global teams and confident interacting with engineers through to executive management Automotive experience at Tier 1, Tier 2 or OEM level B.S. or M.S. in Electrical Engineering Nice to Have (The "Competitive Advantage"): Good understanding of embedded software drivers Understanding and experience of OSI network layers 2+ Experience of Ethernet switches and understanding of IEEE802.1 protocols Experience with TSN protocols Experience with PCIe protocols and topologies Experience covering high speed PCB board design, layout and routing constraints Experience with ROS / ROS2, Isaac Sim, CUDA, etc Personal Skills: Excellent communication/documentation skills Attention to details Collaboration across multidisciplinary and international teams Self-motivated and able to work effectively both independently and in a team What You Can Expect From Ethernovia: Technology depth and breadth expansion that can’t be found in a large company Opportunity to grow your career as the company grows Pre IPO stock options Cutting edge technology World class team Competitive base salary Flexible hours Medical, dental and vision insurance for employees Salary Range: The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $180,000 - $240,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, as well as eligibility for performance bonuses, in addition to base salary and a full range of medical and other benefits. * Principals Only (No Agencies) #LI-Hybrid

Responsibilities

You will support the field team and customers by integrating high-performance Ethernet solutions into advanced hardware and software systems. This role involves collaborating with internal engineering teams to support customer designs from concept through validation and production.