Principal Chipset Project Engineer – Thermal/Limits for Personal Computer ( at Qualcomm Global Trading Pte Ltd

San Diego, California, United States -

Full Time

Start Date

Immediate

Expiry Date

03 Jul, 26

Salary

317900.0

Posted On

04 Apr, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal management, System design, Architecture, Silicon design, Validation, Software development, Technical leadership, Project engineering, Thermal modeling, Performance tuning, Semiconductor product development, Cross-functional collaboration, Executive communication, OEM/ODM engagement, Thermal debug

Industry

Semiconductor Manufacturing

Description

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Mobile Chipset PE, MDM & MSM General Summary: Qualcomm’s Compute Chipset Project Engineering team is responsible for the planning and execution of industry leading Compute Chipsets through all phases from concept to commercialization. A Compute Chipset comprises multiple chips that together perform the functions of a compute device (such as Application Processor, PMICs, Audio, Connectivity, Modem), as well as the associated software, firmware and reference hardware. We are seeking a Principal Chipset Project Engineer – Thermal/Limits for Personal Computer (PC) to lead the thermal and limits strategy across the compute product portfolio through all phases from concept to commercialization. Responsibilities include defining system thermal budgets, defining methodologies and tools to analyze and predict thermal behavior, modeling of thermals and thermally constrained performance, influencing designs and planning features, defining and tuning system limits, as well as to provide customer guidance on thermal targets and solutions. This lead will be responsible for extracting the highest thermally constrained system performance possible out of systems with fixed product constraints. Works closely with domain and IP specific engineering leads, Project Engineers, Product Management, and Program Management. Role also requires a strong engagement with OEMs and ODMs. Responsible for clearly communicating thermal goals, strategy, and status to executives and chipset teams. Works in a highly matrixed environment. This role frequently requires working with others to fulfill job responsibilities without direct authority. Minimum Qualifications: • Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of Electrical, Computer, or Software Engineering or related work experience. OR Master's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 7+ years of Electrical, Computer, or Software Engineering or related work experience. OR PhD in Electrical Engineering, Computer Science, Computer Engineering, or related field and 6+ years of Electrical, Computer, or Software Engineering or related work experience. • 8+ years of experience in one or more areas of semiconductor product development. • 5+ years in a technical leadership role. Preferred Qualifications: • Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field. • 10+ years of experience in one or more areas of semiconductor product development (e.g., system design, architecture, silicon design and validation, SW development and test). • 8+ years of experience in a thermal systems role, with a strong preference for PC thermal systems experience. • 4+ years of experience working in a large matrixed organization. • 3+ years of work experience in a role requiring interaction with executive leadership. • Prior experience in the PC industry. Principal Duties and Responsibilities: • Leverage expert knowledge to help guide design and architectural choices for the chipsets, platforms, and software to extract the highest thermally constrained performance while meeting product constraints including cost and size. • Drive methodology and tool development to analyze and predict thermal behavior, assess performance impact, and assist thermal/power/performance tuning. • Evaluate new and novel thermal solutions. • Assess impact of system component selection on thermals. • Influence system limits management feature set and establish best practices to tune for thermal management. • Oversee the resolution of all thermal related issues across the chipsets. • Interacts with customers frequently, providing guidance on thermal targets and support on thermal debug and tuning. Level of Responsibility: • Influences, provides direction and guidance to leads and managers who may not be direct reports. • Decision-making is critical in nature and highly impacts program, product, or project success. • Requires verbal and written communication skills to convey highly complex and/or detailed information. May require strong negotiation and influence with large groups or high-level constituents. • Has influence over the formulation and achievement of long-term business plans and objectives. • Tasks often require multiple steps which can be performed in various orders; extensive planning, problem-solving, and prioritization must occur to complete the tasks effectively. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $211,900.00 - $317,900.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

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Responsibilities

Lead the thermal and limits strategy for compute chipsets from concept to commercialization while defining system thermal budgets and methodologies. Influence design choices and collaborate with cross-functional teams and OEMs to maximize thermally constrained system performance.