Principal Design Engineer, TSV Packaging at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

05 Apr, 26

Salary

0.0

Posted On

05 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Finite Element Analysis, Thermal Compression Bonding, Collaboration, Simulation, Mechanical Design, EDA Techniques, ANSYS, MATLAB, SolidWorks, AutoCAD, Material Science, Fracture Simulations, Data Acquisition, Numerical Analysis, Thermo-Mechanical Problems, Product Reliability Testing

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM, RDIMM/LRDIMM and CAMM modules, graphics GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical requirements of the future. Finite element analysis of package design enables innovation and development of outstanding solutions to help foster our goals. Utilization of FEA techniques and their application to our industry will make Micron more impactful and relevant. Key aspects of this role will be to innovate, influence, collaborate, partner, and implement. Responsibilities: Stay up-to-date on semiconductor and advanced electronics packaging technologies like High Bandwidth Memory (HBM) and Flip Chip. Detailed understanding of thermal compression bonding process for chip-on-wafer and wafer-to-wafer hybrid bonding process and the corresponding Multiphysics mechanisms involved to capture in the simulation. Collaborate daily with global teams in product design, engineering, technology, and business units to analyze manufacturing processes using simulation. Understanding of packaging materials and their production processes. Work with internal/external vendors and testing labs to craft and implement effective testing procedures to characterize materials for simulation analysis. Maintain an understanding of measurement methodologies and coordinate measurement data collection of packages and packaging materials for correlation of simulation activities. Develop semiconductor packages with advacned EDA techniques and simulation tools like ANSYS, Icepak, Flotherm. Minimum Qualifications: 8+ years working experience in Mechanical and Thermo-mechanical finite element analysis, modeling and validation of electronic packages in Semiconductor industry or equivalent. Engineering tools: ANSYS Workbench, APDL, Abaqus, ProE or equivalent experience, AutoCAD, Solid Works, MATLAB. M.S. / Ph.D. in Mechanical Engineering, Material science, or related Engineering field. Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results. Seeking a dedicated, motivated individual to balance tasks efficiently and work well in a team. Preferred Qualifications: Simulation, modeling, and analysis of thermos-mechanical problems by multi-physics with software like Ansys, COMSOL, etc. Proven academic training and research experience in Solid and fluid mechanics. Experience in performing fracture simulations for IC packages. Experience in semiconductor process simulation like wafer-to-wafer bonding process, thermal compression bonding process, mass reflow process, die ejection process, etc. Ability to bring to bear the distributed team members and develop new characterization methods for new designs. Knowledge in product reliability tests like thermal cycling, and other environmental stresses. Mechanical design capability (2D, 3D) with SolidWorks, AutoCAD, etc. Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The role involves innovating and designing high-performance memory devices while collaborating with global teams to analyze manufacturing processes. The engineer will utilize finite element analysis to develop outstanding packaging solutions.