Principal Engineer, DEMQRA HBM PQRA (Product Quality and Reliability Assura at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

07 Apr, 26

Salary

0.0

Posted On

07 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Electrical Engineering, Semiconductor, DRAM Operation, Fabrication Process, Device Physics, Advanced Packaging, Wafer Testing, Component Testing, Module Testing, Troubleshooting, Organizational Skills, Attention to Detail, Communication Skills, Statistical Analysis, Programming, Root Cause Analysis

Industry

Semiconductor Manufacturing

Description

Define High Bandwidth Memory (HBM) qualification requirements Comprehend failures and failure rate within the scope of the qualification Perform risk assessment at all decision points within the qualification cycle Review qualification data and sign off that qualification requirements have been met Issue internal product release notifications for Qualification Cooperatively develop and establish reliability targets and standards with technology development and product engineering teams Comprehend new wafer fab and packaging technologies to identify and mitigate product reliability issues Develop and improve product reliability tests to assess new HBM failure mechanisms Coordinate and drive validation of reliability improvements for existing products Review internal quality metric and drive customer DPM to BIC Establish and review ongoing product Quality Metrics Assess deviations for product quality and reliability risks Data mining and root cause analysis of test data. Root cause finding and drive CA/PA. Develop risk mitigation processes to mitigate risks Perform reliability assessment and Excursion Analysis Review qualification data to defined release/acceptance criteria BS or MS in Electrical engineering or related field of study 8+ years of experience in semiconductor field Knowledge of DRAM operation, fabrication process and semiconductor device physics Familiarity with advanced packaging, wafer testing, component testing and module testing concept and flow Strong troubleshooting skills Good organizational skills and sharp attention to detail Good written and oral communication skills Ability to work independently or in a group environment Knowledge of using statistical like JMP, Familiarity with Unix, DFII/Cadence, and/or ATE (Auto Test Equipment) preferred Familiarity with Perl, C++, Python, HTML, CGI, or Java preferred Product Engineering Product Quality and Reliability Process Integration Product Yield Enhancement Guide a team of engineers through the full product qualification lifecycle, ensuring technical excellence and timely delivery. Deliver impactful presentations and lead strategic discussions with senior leadership to align on goals, progress, and outcomes.

Responsibilities

Define High Bandwidth Memory (HBM) qualification requirements and perform risk assessments throughout the qualification cycle. Review qualification data, issue product release notifications, and develop reliability targets in collaboration with engineering teams.