Principal Engineer Package Technology Development at Infineon Technologies AG Australia

Ipoh, Perak, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

16 Apr, 26

Salary

0.0

Posted On

16 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Power Module Development, Technical Guidance, OSAT Collaboration, Problem-Solving, Project Management, Process Development, Automotive Standards, Reliability Requirements, Materials Knowledge, New Product Introduction, Change Projects, Technical Leadership, Analysis, Verification, Validation

Industry

Semiconductor Manufacturing

Description

To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8-inch wafer conversion TCM and additional customer requirements /qualification for the package. Job Description In your new role you will: Package Design and Development: Design and develop power module and power package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products. Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies. Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials. Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned. Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope. Your Profile You are best equipped for this task if you have: Bachelor's or Master's degree in a relevant field, such as Materials Science, Mechanical Engineering, Electrical Engineering Chemical Engineering, Physics. Over 10 years of experience in package development, process development(assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects. Good technical knowledge of Back End processes & material knowledge in lead frame, AMB, module and power packages and interaction to the different functions (eg. design rules, direct materials and processes qualification). Good understanding of Automotive quality / reliability requirements and standards. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

The Principal Engineer will design and develop power module and package technologies while providing technical guidance to OSAT partners. They will also drive technical decision-making and manage projects to resolve technical issues.