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Principal Engineer Package Technology Development at Infineon Technologies AG Australia

Ipoh, Perak, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Package Development, Process Development, Project Management, New Product Introduction, Automotive Quality, Reliability Requirements, Back End Processes, Material Knowledge, Design Rules, Direct Materials, Processes Qualification

Industry

Semiconductor Manufacturing

Description

Bachelor's or Master's degree in a relevant field, such as Materials Science, Mechanical Engineering, Electrical Engineering Chemical Engineering, Physics. Over 10 years of experience in package development, process development(assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects. Good technical knowledge of Back End processes & material knowledge in lead frame, AMB, module and power packages and interaction to the different functions (eg. design rules, direct materials and processes qualification). Good understanding of Automotive quality / reliability requirements and standards. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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Responsibilities

The Principal Engineer will lead package technology development and manage projects focused on New Product Introduction and change/transfer projects. The role requires collaboration across different functions to ensure successful package development and process qualification.