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Principal Engineer Package Technology at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics, Physics, Semiconductor Packaging, Assembly, Test, Process Engineering, Equipment Engineering, Reliability Analysis, Risk Assessment, Process Flow, Unit Processes

Industry

Semiconductor Manufacturing

Description

Execute PBC and TPC assessment within A-project development. Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow. Support Pre development for new Chip technology / new package development within development platform. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics). 8 years of relevant working experience in IC/semiconductor environment. Experience in Semiconductor Packaging, Assembly and Test. Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction between FE-BE / BE-BE processes). Excellent technical knowledge of Process and Equipment Engineering. Good knowledge on the internal package analysis and first level reliability. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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Responsibilities

Execute PBC and TPC assessments within A-project development and integrate unit processes in the package platform. Support pre-development for new chip technology and new package development within the development platform.