Principal Hardware Development Engineer - Signal/Power Integrity at Advanced Micro Devices, Inc

Santa Clara, California, United States -

Full Time

Start Date

Immediate

Expiry Date

28 Jul, 26

Salary

0.0

Posted On

29 Apr, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Signal Integrity, Power Integrity, PCB Design, Package Design, High-speed Architecture, PCIe, Ethernet, DDR, Keysight ADS, Cadence Sigrity, Ansys HFSS, MATLAB, Python, TDR, VNA, Oscilloscopes

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a Principal Member of Technical Staff in Networking Technology & Solutions Group (NTSG), you will be responsible for ensuring that AMD’s next-generation products deliver industry-leading reliability, performance, and efficiency. This role involves designing, analyzing, modeling and validating complex systems with high-speed channels and high-power components. THE PERSON: In this role, you will closely collaborate with Silicon IP team, ASIC packaging team, PCB design team, System Architect and external partners/suppliers to meet the most demanding signal/power integrity requirements while ensuring manufacturability. KEY RESPONSBILITIES: Model and simulate the end-to-end high-speed channels including transceivers, IC package, PCB and cross-boards connectors/cables Utilize industry-standard tools and methodologies to perform a variety of time/frequency domain signal integrity analysis (IBIS-AMI, SPICE, full-wave EM analysis, etc.) Identify the link quality such as loss, reflection and crosstalk, and resolve the issues Conduct channel-simulations to optimize Eye Diagram, Bit Error Rate (BER) and Signal-Noise-Ratio (SNR) for high-speed signaling across complex systems Perform Channel Operation Margin (COM) analysis to validate the channel health for IEEE compliance Excise Design of Experiments (DOE) sweeping to statistically evaluate the signal integrity qualities across process variations, like silicon corners, trace impedance, routing length, terminations, etc. Interpret the simulation results to provide the design guidelines on board materials, stack-up, transmission line routings, component placement and layout optimization Work on critical circuits (especially reference clocks and high-speed signals) to ensure signal integrity and power integrity Drive PCB physical design, create PCB stack-up, generate PCB design rules, review PCB layout, identify the potential signal integrity and power integrity issues, and propose solutions Support lab validation and debugging to correlate with the simulation data Collaborate with cross-functional teams to drive product development while keeping projects on schedule and within scope. Stay at the forefront of signal integrity and power integrity innovations and high-speed design technologies, ensuring that AMD continues to lead the industry PREFERRED QUALIFICATIONS Extensive experience in high-speed signal integrity and power integrity engineering fields Strong background in PCB and package design for signal integrity and power integrity Strong expertise in high-speed architecture, interconnects and PCB/package design Deep knowledge of high-speed interfaces (PCIe, Ethernet, DDR, etc.) Proficiency in SI/PI simulation tools (Keysight ADS, Cadence Sigrity, Ansys HFSS) Familiarity with MATLAB or Python for data analysis and automation Hands-on experience with lab testing tools (TDR, VNA, High-Speed Oscilloscopes, Spectrum Analyzer) Excellent problem-solving and cross-functional collaboration skills ACADEMIC CREDENTIALS: Master or PhD’s degree in Electrical Engineering, Computer Engineering, or related fields This role is not eligible for visa sponsorship. #LI-DNI Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

The role involves designing, modeling, and validating complex high-speed systems to ensure reliability, performance, and efficiency. You will collaborate with cross-functional teams to drive PCB physical design and perform signal and power integrity analysis.