QUALIFICATIONS YOU MUST HAVE:

• Bachelor’s degree (typically in Science, Technology, Engineering or Mathematics (STEM)) and a minimum of 8 years of prior relevant experience OR Advanced Degree in a related field and minimum 5 years experience OR In absence of a degree, 12 years of relevant experience is required
• Must be a U.S. Citizen
• Must have or be capable of obtaining a US Department of Defense (DoD) security clearance. Candidate selected will be subject to a government security investigation/reinstatement and must meet eligibility requirements
• Knowledge of mechanical principles and techniques commonly used in product development
• Applied knowledge of moderate to advanced mechanical engineering principles and techniques
• Capable of performing mechanical design and analysis to meet severe environment system requirements
• Proficiency in 2D and 3D computer aided design (CAD) tools (e.g. AutoCAD, Solidworks)
• Working knowledge of structural, dynamic and thermal analysis tools (e.g. ANSYS)

QUALIFICATIONS WE PREFER:

• Microelectronics design and manufacturing assembly
• Flip chip experience including development and design is preferred
• Microelectronic packaging materials and material properties
• Post wafer fabrication processes
• Failure analysis techniques
• Demonstrated capability in design for low cost, manufacturability and small volume packaging
• Ability to decompose mechanical requirements to support design efforts
• Proficiency in MS Office products
• Experience with cost account and schedule management
• Experience with geometric dimensioning and tolerancing (GD&T)
• Excellent interpersonal and communication skills, written and verbal, to support frequent customer meetings and pursuit related activities
• Ability to work in a team environment and interact with various engineering disciplines (e.g. mechanical engineers, electrical engineers and system engineers)

Onsite
Do you want to be a part of something bigger? A team whose impact stretches across the world, and even beyond? At Collins Aerospace, our Mission Systems team helps civilian, military and government customers complete their most complex missions — whatever and wherever they may be. Our customers depend on us for intelligent and secure communications, missionized systems for specialized aircraft and spacecraft and collaborative space solutions. By joining our team, you’ll have your own critical part to play in ensuring our customer succeeds today while anticipating their needs for tomorrow. Are you up for the challenge? Join our mission today.
Principal Mechanical Engineer - Microelectronics Packaging (Onsite)
Looking for a highly motivated person to be a Mechanical Engineer within the Mission Systems (MiS) Microelectronics Packaging Group. This group is responsible for the Microelectronics Packaging technology activities throughout Collins Aerospace Mission Systems.
This position is for a Principal Mechanical Engineer involved in the design and development of microelectronics packaging products and technologies. This opportunity is located in Cedar Rapids, Iowa. Responsibilities in this rapidly growing area include: leading moderately-sized projects, coordinating laboratory efforts, packaging conceptualization, technology development, preliminary / detailed design, prototype build & evaluation, qualification testing, factory transition, and manufacturing support.
This mechanical engineer will be involved in all aspects of microelectronics packaging design and must possess good Mechanical Engineering skills including the desire to design and develop state of the art miniaturized electronic devices. The successful candidate must also have good written & verbal skills, have a willingness to learn & expand their technology base, and work well within a diverse team environment.