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Principal Process Engineer, Die Bonding at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

09 Jan, 26

Salary

0.0

Posted On

11 Oct, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Die Bonding, Process Engineering, Data Analysis, Design of Experiments, Yield Improvement, Cost Reduction, Project Management, Communication, Attention to Detail, Self-Motivated, Collaboration, Semiconductor Packaging, Fusion Bonding, Hybrid Bonding, Direct Bonding, Heterogeneous Integration

Industry

Semiconductor Manufacturing

Description

Develop, diagnose, and resolve various die bonding process technologies Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step Lead and participate in continuous yield improvement and cost reduction activities Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives Support SPC/FDC/RMS/APC and site-to-site portability Support internal and external audits A BS degree with minimum 5+ years proven experience in Semiconductor Process Engineering Solid engineering knowledge of semiconductor advanced packaging die stacking processes Skilled at designing valid tests and Design of Experiments (DOE) Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs Excellent oral and written communication skills and a strong attention to detail Highly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributor Knowledge and an understanding of project management Masters or Doctorate degree in Engineering, Physics, or related field Experience in working on Die Bonding : Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

Responsibilities

Develop, diagnose, and resolve various die bonding process technologies while coordinating and executing process, equipment, and material evaluation initiatives. Lead continuous yield improvement and cost reduction activities, and manage relationships with material suppliers to achieve quality and risk management objectives.