Principal / Senior Engineer, NPI - IC Assembly, Technical Operations Manage at Aumovio

Singapore, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

04 Jun, 26

Salary

0.0

Posted On

06 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

New Product Introduction (NPI), IC Assembly, OSAT Management, Automotive IC Assembly, Package Development, Mass Production, Cross-functional Coordination, Assembly Procedures, Data Exchange Setup, Traceability, Yield Monitoring, Root-Cause Analysis, Corrective Actions, Quality Standards Compliance, Technical Reporting, Mentoring

Industry

Motor Vehicle Manufacturing

Description

Job Description We are seeking a detail-oriented and analytical NPI - IC Assembly professional to join our team in Singapore, Singapore. In this role, you will be responsible for overseeing the New Product Introduction (NPI) process for Integrated Circuit (IC) assembly, ensuring efficient and high-quality production of new semiconductor products for automotive application. Lead the new production introduction (NPI) for Automotive IC assembly process (e.g.: QFP, QFN, BGA) from package development to mass production at OSAT (Outsourced Semiconductor Assembly and Test). Coordinating with cross-functional teams to ensure smooth product launches, manufacturability and ramp-up. Develop and implement assembly procedures and work instructions for new products. Support in data exchange setup with OSAT for part traceability, quality assurance and yield monitoring. Monitor and optimize IC assembly processes to improve efficiency and yield. Troubleshoot assembly-related issues and drive improvement projects to meet Support in customer complaints events, lead root-cause analysis and corrective actions implementation at OSAT. Ensure compliance with quality standards and industry regulations. Prepare technical reports on NPI project status, risks and milestones, and presentations for management and stakeholders. Mentor and train junior team members on IC assembly techniques and best practices. Qualifications Bachelor’s degree in Electronics Engineering, Electrical Engineering or related field. Minimum 5years of working experience in IC package assembly or OSAT management on technical topics. Preferable with strong proficiency in IC assembly processes or package development for automotive applications. Proven experience with NPI processes in semiconductors. Familiarity with industry automotive standards and regulations (e.g., AEC-Q100, JEDEC. IPC standards) Excellent problem-solving skills and data analytical competency. Strong communication skills, both verbal and written (e.g., Business English, Presentations) to interact with internal and external stakeholders. Demonstrated ability to work effectively in a fast-paced, team-oriented environment. Additional Information Ready to take your career to the next level? The future of mobility isn’t just anyone’s job. Make it yours! Join AUMOVIO. Own What’s Next. Legal Entity: AUMOVIO Singapore Pte. Ltd. (0711) Referral Bonus : Yes Job flexibility: Onsite Job Leadership level: Leading Self Working time: Full Time

Responsibilities

This role involves overseeing the New Product Introduction (NPI) process for Integrated Circuit (IC) assembly, focusing on ensuring high-quality production of new semiconductor products for automotive applications. Key duties include leading the NPI for various IC assembly processes from development to mass production and coordinating with cross-functional teams for smooth product launches.