Principal, System Architect (Pre-sales) at Schneider Electric Industries Malaysia

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

13 Sep, 26

Salary

0.0

Posted On

15 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal System Design, Liquid Cooling, Datacenter Cooling, P&ID Diagrams, Energy Modeling, Psychrometric Analysis, AI DC Thermal Design, Pre-sales Engineering, Solution Architecture, Equipment Sizing, BOM Creation, Customer Engagement, ASHRAE Standards, Uptime Institute Tier Requirements, AutoCAD, Revit

Industry

Automation Machinery Manufacturing

Description

MISSION The System Architect – Mechanical is the thermal engineering authority for assigned strategic accounts within the zone. This role owns the end-to-end cooling and thermal system design for datacenter solutions, from primary chiller plant through in-rack liquid cooling delivery. Working as a core member of the account fighting unit with the Key Account Manager and Segment Solution Architect, the SAM-Mechanical strengthens technical positioning and drives successful deal closure. The role is accountable for thermal solution quality, technical standards compliance, and building deep customer credibility at the mechanical engineering level. KEY RESPONSIBILITIES Thermal System Design (Core Engineering) Design complete cooling and thermal management systems for datacenter solutions: Primary chiller plant: water-cooled and air-cooled configurations, sizing, redundancy strategies (N, N+1, 2N) Heat rejection systems: cooling towers, dry coolers, adiabatic cooling, seasonal performance modeling Chilled water distribution: primary/secondary loop design, variable flow optimization, delta-T management Precision air systems: CRAH/CRAC sizing, hot aisle/cold aisle containment, airflow design In-row cooling and rear-door heat exchangers (RDHx) for high-density environments Liquid cooling systems: CDU sizing for 30–200+ kW clusters, warm water interfaces (up to 45°C), OCP OLC-compliant manifolds AI DC thermal design: GPU cluster-scale cooling, NVL72/GB200 CDU configuration, hybrid air+liquid architectures Energy modeling: PUE contribution from cooling, WUE analysis, free-cooling availability, economization strategies Solution Engineering Deliverables Produce all cooling engineering outputs for bids: Cooling load calculations and psychrometric analysis Equipment sizing schedules and specifications P&ID diagrams (concept and scheme level) Piping layout sketches and CDU configuration schedules Bill of Materials (BOM) for cooling scope OG vendor specifications (third-party product selection) Design handover packages when solutions are won Customer & Consultant Engagement Lead cooling-scope technical discussions with customers; defend design decisions at engineer-to-engineer level Conduct cooling-specific technical workshops with design consultants; embed Schneider standards in RFP briefs Support EPC contractor engagement: pre-construction design reviews, technical clarifications, interface resolution Present cooling technology roadmap to primary accounts, especially AI DC thermal futures Build and maintain direct technical relationships with customer mechanical engineering teams Fighting Unit & Bid Support Work as core member of the account fighting unit: SSA (solution strategy), SAE-Electrical (power train), SAM-Mechanical (thermal train), Digital Solution Architect, KAM (customer relationship) Co-design with System Architect – Electrical: align cooling loads with electrical BoM, CDU power inputs, BMS integration points Submit qualifying bid designs through Principal Architect review; address technical feedback and rework notices Participate in win/loss debrief reviews: capture cooling-scope decisions and lessons for reference architecture updates Support solution integration: ensure cooling design is competitive, technically correct, and aligned with customer needs Technical Standards & Continuous Improvement Design to Principal Architect-defined cooling reference architectures; document deviations when customer requirements necessitate variation Provide active project inputs to Principal Architect for reference architecture evolution Propose new OG products for qualified list when bids require capabilities not currently available Complete required technical certifications (ASHRAE, Uptime Institute ATD, OCP OLC) Deliver internal technical sessions to zone SSAs on cooling fundamentals, AI DC thermal management, and liquid cooling TECHNICAL COMPETENCY REQUIREMENTS Expert-level competency required across all thermal domains. This person must be the most technically credible voice in the room on cooling when presenting to hyperscaler and large enterprise engineering teams. Core Technical Domains Primary Plant & Heat Rejection: Water-cooled and air-cooled chillers, cooling towers, adiabatic coolers, free-cooling analysis, hybrid economization, primary/secondary loop optimization Precision Air Systems: CRAH/CRAC selection and sizing, hot aisle/cold aisle containment (full and partial), in-row cooling, variable speed drives, economizer modes, airflow modeling basics Liquid Cooling: CDU design and sizing (30–200+ kW clusters), RDHx application, OCP OLC-compliant manifold design, warm water cooling (direct-to-chip), quick-disconnect fittings, leak detection, glycol/DI water specifications AI Datacenter Cooling: GPU cluster thermal profiles (Nvidia NVL72/GB200/HGX), ASHRAE A5 addendum liquid cooling classes, warm water circuits up to 45°C, NVLink/NVSwitch cooling specifications, immersion cooling feasibility Standards & Design Tools: ASHRAE 90.4, ASHRAE A5, Uptime Institute Tier requirements, EN 50600, OCP Open Liquid Cooling (OLC). Tools: HAP/IES-VE (cooling load calcs), AutoCAD/Revit (P&IDs, layouts), psychrometric tools, CDU sizing calculators Essential Degree in Mechanical Engineering or Building Services Engineering (MEng or BE preferred) 8–14 years in datacenter cooling design, commissioning, or presales; minimum 5 years specifically in DC environments Demonstrated design experience: chiller plant, CRAH systems, chilled water distribution (≥2 MW cooling capacity) Working knowledge of liquid cooling: CDU application, RDHx, basic manifold design Experience producing engineering deliverables: cooling calcs, P&IDs, equipment schedules, BoMs Ability to present and defend cooling designs to customer mechanical engineering teams Familiarity with ASHRAE 90.4 and Uptime Institute Tier criteria for cooling Preferred / Advantageous Uptime Institute Accredited Tier Designer (ATD) certification – cooling module ASHRAE Data Center Academy or similar formal certification Direct AI DC experience: GPU cluster cooling, NVL72/HGX thermal requirements, CDU sizing for 100kW+ densities Background with hyperscalers (AWS, Google, Meta, Microsoft, Equinix) or Tier 1 consultants (Arup, WSP, Mott MacDonald, Syska) Immersion cooling experience (single-phase or 2-phase design/feasibility) Presales or solutions engineering background – comfort with pre-RFP design and customer pressure environments

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Responsibilities

The role serves as the thermal engineering authority for strategic accounts, owning the end-to-end cooling and thermal system design for datacenter solutions. Responsibilities include producing engineering deliverables for bids and leading technical discussions with customers and consultants to drive deal closure.