Principal Thermal Simulation Engineer, APTD at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

05 Jan, 26

Salary

0.0

Posted On

07 Oct, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal Simulation, Finite Element Analysis, Modeling, Validation, Thermal Engineering, EDA Techniques, ANSYS, Icepak, Flotherm, MATLAB, Thermal Testing, Cooling Solutions, Data Acquisition, Visualization Techniques, Documentation, Team Collaboration

Industry

Semiconductor Manufacturing

Description

Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Wafer (COW), Flip Chip, Through Silicon Vias (TSV), etc Detailed understanding of package thermal budget and thermal compression bonding process as well as Hybrid and other innovative bonding processing methods. Work daily with multi-functional global teams, namely product design, product engineering, Technology development, Business unit, manufacturing and external customers to fully understand the product thermal risks and help optimize the packaging design by simulation support Work with internal/external vendors and testing labs to design and implement effective Thermal testing procedures to characterize materials for simulation analysis Use advanced EDA techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal simulation applications such as ANSYS, Icepak, Flotherm and evaluate new AI assisted EDA tools as needed Work with customers and propose new power maps and cooling solutions on SIP level that provide optimal memory performance. 15 years working experience in relevant engineering area with at least 10 years of experience on Thermal finite element analysis, modeling and validation of electronic packages in Semiconductor industry or equivalent. Experience with engineering tools such as ANSYS Workbench, APDL, Abaqus, ProE, AutoCAD, Solid Works, MATLAB M.S. or Ph.D. in Engineering, with focus on Thermal Engineering field. Simulation, modeling, and analysis of thermal problems by multi-physics with Icepak, Flotherm. Ability to leverage the global team members and develop new thermal characterization methods for new designs. Knowledge in product reliability tests like thermal cycling, and other environmental stresses and understand if there is any power cycling vs Temp cycle Rel data correlation. Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results. Data acquisition experience, visualization techniques and numerical analysis proficiency in MATLAB, Excel, JMP, etc. is a plus Looking for a passionate, hardworking and self-motivated individual with the ability to handle multiple tasks, use good time management, while being a great teammate who is optimistic and responsible.

Responsibilities

The Principal Thermal Simulation Engineer will maintain knowledge in semiconductor and advanced electronics packaging technologies and work with global teams to optimize packaging design through simulation support. They will also design and implement thermal testing procedures and propose cooling solutions to enhance memory performance.