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Principal, Wafer Bonding Process Integration Engineer at Micron Technology

Hiroshima, , Japan -

Full Time

Start Date

Immediate

Expiry Date

07 Mar, 26

Salary

0.0

Posted On

07 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wafer Bonding, Process Integration, Technical Leadership, Mentorship, Troubleshooting, Statistical Process Control, Material Characterization, Analytical Skills, Problem-Solving, Communication Skills, Fusion Bonding, Innovation, Collaboration, Deep Dive Analyses, Flexibility, Data-Driven

Industry

Semiconductor Manufacturing

Description

Lead the implementation of Wafer Bonding integration processes, ensuring the best performance and reliability. Work cross-functionally to define integration requirements and establish best practices for wafer bonding technologies according to product requirement. Drive innovation in wafer bonding methodologies, benchmark/evaluate new bonding technologies / solutions and stay updated on industry innovations and state-of-the-art techniques. Provide technical leadership and mentorship to junior engineers Conduct deep dive analyses and troubleshooting of wafer bonding integration issues, leading and implementing corrective actions as necessary. Collaborate with Process teams in US to transition and setting up. Master's Degree or equivalent experience in Electrical engineering, Semiconductor Device Technology, Physics, or related field. Minimum of 10 years of the industry experience, with 3-5 years in Wafer Bonding technology. Expertise in Fusion Bonding is required. Knowledge in the use of statistical process control and analysis tools. Strong understanding of material characterization and analysis techniques relevant to wafer bonding. Strong analytical and problem-solving skills, both technical and interpersonal. Pragmatic and flexible attitude with a result- and data-driven can-do mentality. Excellent communication skills, written and verbal communication in English. Japanese communication desired, but not mandatory Ability to convey complex technical concepts to diverse audiences.

Responsibilities

Lead the implementation of wafer bonding integration processes and drive innovation in wafer bonding methodologies. Collaborate cross-functionally to define integration requirements and troubleshoot integration issues.