Start Date
Immediate
Expiry Date
28 May, 26
Salary
0.0
Posted On
27 Feb, 26
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Engineering, Wafer Backend Process, Troubleshooting, Process KPIs, Equipment Maintenance, Analytical Skills, SPC, OPAC, Mechanical Dimensioning, Tolerancing Analysis, Poka-Yoke, Interpersonal Skills, Problem-Solving, Computer Literacy, Coating Process, Die Saw
Industry
Semiconductor Manufacturing