Start Date
Immediate
Expiry Date
08 Aug, 26
Salary
200000.0
Posted On
10 May, 26
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Development, Mechanical Engineering, Materials Science, Automated Equipment, Optical Device Alignment, Flip Chip Assembly, Thermocompression Bonding, Design of Experiments (DOE), Failure Mode Effects Analysis (FMEA), Statistical Analysis, CAD, Creo, SolidWorks, Optoelectronic Module Assembly, Clean Room Operations, Dimensional Tolerances
Industry
Telecommunications