We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to help meet that commitment. The success we are striving will be the result of very skilled people working in an environment which cultivates creativity, partnership, and thinking of old problems in new ways. If that sounds like the kind of environment that you find intriguing, then let’s talk. These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a team that sets the standard in cultivating excellence, creativity and innovation. Excellent opportunity to join our Process Development team. The successful candidate will have opportunity to conduct feasibility studies, develop new process and material development for new module technologies under research and development. Will you help us design the next generation of revolutionary Apple products?

DESCRIPTION

• Work on process equipment to conduct proof of concept evaluation and DOEs - Establishment of baseline process and metrics - Perform process characterisation - Establish design guidelines for manufacturability - Define procedures and metrologies - Generate engineering report base on studies and evaluation - Reporting of engineering studies to cross-functional team

MINIMUM QUALIFICATIONS

• Degree of Science in Engineering or equivalent
• Minimum 5 years of experience in doing process R&D
• Hands-on experience in various module assembly processes such as flip chip, flex attach, pick and place, dispensing, wire bonding, filling, laser soldering, component cleaning, curing, plating, singulation, wafer bonding.

PREFERRED QUALIFICATIONS

• Good knowledge in design of experiment (DOE), engineering statistic, root cause analysis and problem solving
• Familiarity on different metrology tools and quantitative measurement methodology
• Clear and effective written and communication skill
• Resourceful and innovative
• Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic, Thermocompression and etc) OR 2) EVO die bonder, EVG and Suss process equipment OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding), Solder Jetting/Laser Wire Soldering OR 5) SMT (e.g. solder printing, component pick&place, AOI, SPI and reflow)
• Knowledge on adhesive or epoxy or other bonding material is an advantageExperience in optical components, active alignment and high accuracy bonding process is preferred
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Please refer the Job description for details