Process Engineer 4 at Lam Research

Albany, New York, United States -

Full Time

Start Date

Immediate

Expiry Date

03 Jul, 26

Salary

0.0

Posted On

04 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process engineering, Semiconductor manufacturing, Thin film deposition, CVD, ALD, Plating, Statistical process control, Design of experiments, Matlab, Python, JMP, Minitab, Plasma physics, Material characterization, Problem-solving, Data analysis

Industry

Semiconductor Manufacturing

Description

The group you’ll be a part of The Office of the CTO is where innovation takes center stage. We inspire our global technical community to take on grand challenges, understand emerging trends, identify the critical inflections, and drive our sustainability, Environment, Social, and Governance (ESG) practices that will define the next generation of semiconductors and continued impact. The impact you’ll make As a Process Engineer at Lam, you will operate on cutting-edge technology, harnessing atomic precision, material science, and surface engineering to push technical boundaries. Your role involves developing new and advanced process formulations, defining equipment hardware to meet processing requirements, evaluating test data, and coordinating design requirements to ensure compatibility of processing methods. Your expertise and knowledge play a crucial role our customers success, making an impact on the next generation of semiconductor breakthroughs. In this role, you will directly contribute to deposition process development for sub 2nm CMOS logic nodes. What you’ll do Conduct process engineering research, development, and evaluation in support of Lam’s cutting-edge semiconductor equipment and systems. Review and enhance processing techniques and methods applied in the manufacture and fabrication of products. Develop and sustain new processes and process improvements to reduce production costs and increase yields. Compile and analyze test data to establish next steps in process development and determine appropriate limits and variables for process specifications. Collaborate internally to plan, collect data, analyze results, and report on customer demos for existing process applications. Partner cross-functionally and with customers to understand roadmaps, process flow, inflection points, requirements, and business challenges. Contribute to next generation product development and release activities supporting the semiconductor roadmap. Provide leadership, clear direction, and guidance to process technicians to support execution activities. Be responsible for thin film deposition (CVD, ALD, plating) process development projects in support of LAM JDAs with IBM. Collaborate with customer process engineers to develop solutions Collaborate with customer process and hardware engineers to troubleshoot hardware/process problems/interactions. Be flexible to be cross trained into dry etch, wets/clean and process integration. Deliver creative solutions in process design and its applications. Present results, both internally and externally, to engineers, executives, customers, etc Who we’re looking for Minimum Qualifications: Master’s degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 6+ years of experience; or a PhD with 3+ years’ experience; or equivalent experience. Preferred qualifications Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques. In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE). Highly proficient in MATLAB, Python, or other similar scientific computing language. Working knowledge of statistical analysis and problem-solving methodologies. Experience with statistical tools (JMP, Minitab, etc.) Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD). Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP). Knowledge of Material synthesis and material characterization. Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners. Experience in semiconductor, process design, deposition, etch dielectrics or conductor, metal films, etc. Our commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Our Perks and Benefits At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.

Responsibilities

The role involves developing and sustaining advanced deposition processes for sub 2nm CMOS logic nodes while collaborating with customers to troubleshoot hardware and process interactions. You will also provide technical leadership to process technicians and analyze test data to optimize production yields and costs.