Process Engineer – Advanced Semiconductor Packaging at Keysight Technologies - Hong Kong

Santa Rosa, California, United States -

Full Time

Start Date

Immediate

Expiry Date

15 Jul, 26

Salary

0.0

Posted On

16 Apr, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor fabrication, Advanced packaging, System in package, Statistical process control, Design of experiments, Flip chip bonding, Surface mount technology, Die singulation, Heterogeneous integration, New product introduction, Technical project management, Process integration, Design for manufacturing, Microwave engineering, Compound semiconductors

Industry

electrical;Appliances;and Electronics Manufacturing

Description

Overview Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. Established over 50 years ago, Keysight’s HFTC provides semiconductors that drive Keysight's market leadership and revenue. Located in the beautiful wine country of Sonoma County in Santa Rosa, California, HFTC is a world-class semiconductor organization that invents, designs, and manufactures state-of-the-art custom integrated circuits (ICs) to enable the industry’s highest-performance test and measurement solutions. HFTC’s proprietary indium phosphide (InP) and gallium arsenide (GaAs) semiconductor platforms make possible some of the world’s highest-speed and highest-frequency Monolithic Microwave Integrated Circuits (MMICs). These chips are custom designed to enable instrumentation with unmatched signal fidelity, bandwidth, and dynamic range. Keysight’s 50,000 sq. ft. microfabrication facility—paired with deep expertise in IC design, modeling, and advanced compound semiconductor manufacturing—provides a distinct competitive advantage in delivering industry-leading performance. Responsibilities We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries. Responsibilities may include: Develop and maintain wafer fabrication processes Develop and maintain package assembly processes Specify, select and qualify new equipment Contribute to process automation Review new designs for manufacturability and provide feedback to module designers Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams Meet accelerated project schedules; communicate and manage risks Develop and maintain high yields while adhering to project schedules Qualifications BS or MS or PhD in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields coupled with 2-5+ years of applicable experience in semiconductor fabrication/advanced packaging processes. We are seeking an industry professional with proven expertise in three or more of the following areas: Design for manufacturing of electromechanical assemblies Statistical process control (SPC), design of experiments (DOE) Thermocompression / flip chip bonding Surface Mount Technology (SMT) processes Die singulation Semiconductor fabrication processes Heterogeneous integration, advanced packaging techniques New technology introduction New product introduction Professional experience in the following areas is desired: III-V compound semiconductors and/or silicon technologies Thermal, mechanical and electrical reliability Technical project management, project lifecycle This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in the AI market. Excellent interpersonal and communication skills are important for successful cross-functional interactions. Candidates must be local or willing to relocate to Santa Rosa, CA This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3). Keysight is an Equal Opportunity Employer. Careers Privacy Statement The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below. Santa Rosa, CA Pay Range: MIN $126,930-MID PT $169,240- MAX $211,550 Note: For other locations, pay ranges will vary by region. This role is eligible for Keysight Results Bonus Program and US Employees may be eligible for the following benefits: Medical, dental and vision Health Savings Account Health Care and Dependent Care Flexible Spending Accounts Life, Accident, Disability insurance Business Travel Accident and Business Travel Health 401(k) Plan Flexible Time Off, Paid Holidays Paid Family Leave Discounts, Perks Tuition Reimbursement Adoption Assistance ESPP (Employee Stock Purchase Plan) Restricted Stock Units #LI-MED1

Responsibilities

The role involves leading the development of next-generation System in Package (SiP) modules and managing wafer fabrication and assembly processes. You will collaborate with cross-functional teams to ensure manufacturability, meet performance targets, and manage project schedules.