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Process Engineer IV - (E4) at Applied Materials

Hsinchu, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

15 Feb, 26

Salary

0.0

Posted On

17 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Engineering, Data Analysis, Plasma Etch Techniques, Product Management, Technical Training, Collaboration, Troubleshooting, Technical Documentation, Cross-Functional Projects, Semiconductor Engineering, Problem Solving, Communication, Engineering Projects, Vendor Engagement, New Product Introductions

Industry

Semiconductor Manufacturing

Description

Lead process experiments, data analysis, and reporting across multiple products Characterize hardware and define methods using advanced plasma etch techniques (ICP, CCP, RIE, ion beam) Act as Product Manager, coordinating with field teams, customers, and engineering Provide technical training to field teams for new product introductions Collaborate with TSMC F20 and support on-site engineering needs Travel annually to Gloucester BU for product alignment and team collaboration Develop and execute engineering projects, troubleshoot issues, and guide junior engineers Create technical documentation and specifications Engage with vendors and lead cross-functional projects as needed Master's degree or above in a STEM-related field (PhD is a plus) 10+ years of hands-on experience in plasma etch Strong semiconductor engineering background Experience working with TSMC, managing cross-functional initiatives, or leading new product introductions Proven ability in complex problem solving and cross-team communication Master's Degree (Required) 7 - 10 Years Languages:

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Responsibilities

Lead process experiments and data analysis across multiple products while characterizing hardware and defining methods using advanced plasma etch techniques. Act as Product Manager, coordinating with field teams, customers, and engineering, while also providing technical training and developing engineering projects.