Join SMART Photonics, a rapidly growing and ambitious open foundry specializing in Indium Phosphide (InP) photonic integrated circuits. We are at the forefront of photonics innovation, enabling next-generation technologies in data communication, telecom applications.
We are looking for a Process Engineer (Plasma Deposition & Dry Etch) to strengthen our team.
A challenging and operational role in which you add value to the process team, help us release new purchased equipment, lead the development of processes and train the operations team.

JOB REQUIREMENTS

• MSc or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, or a related field.
• 3–7 years of process engineering experience in a semiconductor or photonics fab.
• Strong knowledge of plasma physics and chemistry, with hands-on experience in ICP, RIE, and PECVD systems (SPTS, Oxford preferred).
• Solid understanding of semiconductor fabrication processes and familiarity with metrology tools (e.g., SEM, profilometry, ellipsometry).
• Proficient in statistical analysis, DOE, SPC, and FMEA; experience with tools like JMP, Python, or Minitab.
• Skilled in root cause analysis and process troubleshooting, with experience supporting fab operations and training.
• Team-oriented, communicative, and proactive—driven to collaborate, solve problems, and continuously improve.
  If this aligns with your experience and passion for advanced plasma processing, we’d love to hear from you. Come join us in pushing the boundaries of photonic chip technology.
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ROLE

As a Process Engineer (Plasma), you will take a hands-on role in sustaining and improving Plasma Deposition (PECVD) and Dry Etch (ICP, RIE) processes. You’ll work closely with cross-functional teams—including Equipment, Operations, Integration, Design, and R&D—to enhance process stability, yield, and cost efficiency, supporting both R&D and high-volume manufacturing.

TASKS

• Lead and optimize plasma processes (etching, deposition, cleaning) on advanced platforms such as ICP, RIE, and PECVD.
• and execute Design of Experiments (DOEs) to refine process windows and improve key metrics (e.g., CD, uniformity, selectivity).
• Perform root cause analysis on process deviations and defects; implement effective corrective actions.
• Collaborate with equipment engineers to ensure optimal tool performance, configuration, and uptime.
• Maintain and improve plasma processes used in photonic chip fabrication, including documentation, control plans, and SOPs.
• Partner with cross-functional teams to improve yields, streamline processes, and support the selection and qualification of new tools and technologies.