Process Engineering Intern at ASM

Tama, , Japan -

Full Time

Start Date

Immediate

Expiry Date

15 Jul, 26

Salary

0.0

Posted On

16 Apr, 26

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Engineering, PEALD, SiN Gap-fill, Semiconductor Devices, Data Analysis, Experimental Design, Physical Modeling, Chemical Modeling, Process Sensitivity Analysis, Deposition Parameters, Throughput Optimization, Simulation, Materials Engineering, Applied Chemistry, Chemical Engineering, Electronic Engineering

Industry

Computers and Electronics Manufacturing

Description

Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. The intern will review PEALD SiN gap-fill process and figure out the mechanism of specific recipe. In parallel, they will review process results and analyze effective deposition parameters for performance improvement. Finally, they will summarize their findings to build the mechanism with physical/chemical model and experimental data. What you will be working on The intern will go through process responses by the single parameter skew. Deposition recipe consists of a lot of parameters. Referring to the typical recipe, it will be to start with suspected effective parameters. Then, they will analyze the process sensitivity in each parameter to figure out what parameter is effective and how effective process improvement is, especially on gap-fill capability (GPC profile) and throughput. There should be some trade-off relationships. The analysis can clarify the effective parameter(s) to have good gap-fill capability and throughput. They will propose what recipe should be good to achieve the target or to maximize throughput, if they have simulation capability, they can collaborate with the team and validate the model of the mechanism by the simulation. The final goal is to show the direction of gapfill performance improvement based on experimental data and theoretical models. What we are looking for For this project, an intern with Materials Engineering, Applied Chemistry, Chemical Engineering and Electronic Engineering or other types of Engineering (Plasma related is preferred) would be ideal. Considering the scope of this project, doctoral degree level is preferred, although a master’s degree level with specific experience would also be acceptable. Apply today to be part of what’s next. We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect. To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube. ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Responsibilities

The intern will analyze PEALD SiN gap-fill processes to determine effective deposition parameters and improve performance. They will build physical and chemical models based on experimental data to optimize gap-fill capability and throughput.