Process Integration Engineer (ITL) at Skorpios Technologies, Inc.

Temecula, California, United States -

Full Time

Start Date

Immediate

Expiry Date

29 Jun, 26

Salary

200000.0

Posted On

31 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Integration, Semiconductor, Etch, Films, Lithography, Metrology, CMP, Lean Manufacturing, Statistical Tools, Device Physics, Process Simulation, Technical Writing, Data Analysis, Team Collaboration, Prioritization, Problem Solving

Industry

Telecommunications

Description

Description Skorpios Technologies, Inc. is seeking a Process Integration Engineer (ITL) to join our growing team. This role focuses on developing production-ready, repeatable, and high-yield processes for state-of-the-art, highly specialized devices in high-speed communications. Responsibilities Develop and execute integration plans and schedules with established manufacturing tools and processes Strong understanding of all major process modules (etch, films, litho, etc.) and understand their interactions in an integrated process flow Correlate output device parameters to inline factory measurements, metrics and processes. Provide reports and data-driven proposals for process changes or performance improvement projects Work closely with Operation and Process Engineering Development organizations Actively drive partners to meet milestones and resolve technical roadblocks Analyze metrology results and disposition lots based on data and pass/fail criteria Requirements Bachelor’s Degree with a focus in Semiconductor, Material & Science or Chemistry Knowledge of lean manufacturing and statistical tools Must have both broad and hands-on knowledge of dielectric deposition, metal deposition, CMP, dry-etch, wet-etch and photolithography. Hands-on integration engineering experience in advanced semiconductor/ MEMS process technology development or related field is highly desired Competencies Work well with teams of engineers Collaborate with multiple internal groups Knowledge of lean manufacturing and statistical tools Strong technical writing skills Be able to work in a dynamic start-up environment Knowledge of advanced semiconductor processing, integration and device design is preferred Candidates with expertise in Front End (FEOL), Back End (BEOL), MEMS, photonics and the integration of novel devices are encouraged to apply Broad expertise in photolithography, dry/wet-etch, deposition, thin films, CMP and metrology is very helpful Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines Background in device physics and experience with process and device simulation are helpful Strong ownership/responsiveness in a manufacturing environment Strong technical team direction skills Good data analysis/statistics skills Good oral/written communication skills Supervisory Responsibilities None. Physical Demands The job is somewhat sedentary, consisting of sitting, standing and walking. May at times carry, push or pull items in excess of 10 pounds Daily use of a computer, copy machine, telephone and general office equipment Work in a cleanroom environment wearing cleanroom gowns and regular use of metrology or characterization equipment Skorpios offers an excellent benefits package that includes: Competitive salary Medical Dental Vision 401(k) Company paid life insurance Company paid disability Paid holidays Paid vacation Travel Requirements Less than 5% anticipated We are an Equal Opportunity Employer and comply with the ADA. Reasonable accommodations will be provided to qualified individuals with disabilities. We do not discriminate based on race, color, religion, sex, national origin, age, disability, or any other legally protected status. ****Recruiters or Agencies will not be considered for this position***

Responsibilities

The role involves developing production-ready, repeatable, and high-yield processes for specialized devices in high-speed communications, requiring the development and execution of integration plans using established manufacturing tools. Responsibilities also include correlating device parameters to factory measurements, proposing data-driven process improvements, and actively driving partners to meet technical milestones.