Process Support Engineer III Senior - (E3) - Plating at Applied Materials

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

23 Feb, 26

Salary

0.0

Posted On

25 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Troubleshooting, Process Characterization, Continuous Improvement, Customer Support, Process Engineering, Data Analysis, Root Cause Analysis, Communication, Interpersonal Skills, Plating Process, Metal Deposition, Project Leadership, Hypothesis Experiments, Design of Experiments, Statistics, Semiconductor Industry

Industry

Semiconductor Manufacturing

Description

Responsibilities include troubleshooting, process characterization, and implementing continuous improvement initiatives to deliver best-in-class plating solutions for next-generation memory devices. Provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment Work closely with the customer to develop leading-edge processes used to manufacture the most advanced semiconductor chips, many of which are inside everyday electronic devices Create hypothesis experiments and design of experiments (DOE); analyze data with statistics; and compile reports with high-level conclusions on technically challenging process engineering experiments Troubleshoot complex problems; perform multiple root cause analysis; and resolve a variety of difficult process engineering and customer product issues Communicate with both internal stakeholders and the customer to achieve goals with a focus on building relationships and establishing trust Apply your growing knowledge of best practices to offer a new perspective using existing solutions Serve as a resource for junior colleagues and a liaison between the customer and business unit; you may also lead small projects with manageable risks and resource requirements Master's degree in chemistry/ physics, materials engineering, electrical engineering, optoelectronics or related field Minimum 7 years of experience in the semiconductor fab or equipment industry Experience in plating process or Metal Deposition (MDP) is highly preferred Strong interpersonal and communication skills to explain sensitive information and work to build consensus among project stakeholders Communication proficiency in English language

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Responsibilities

Responsibilities include troubleshooting, process characterization, and implementing continuous improvement initiatives for plating solutions. Provide customer support through installations, diagnoses, and service of complex systems.