Product Design Engineer - DFM SiP / PCBA NPI at Apple

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

28 Jun, 26

Salary

0.0

Posted On

30 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

SiP Process, PCBA Assembly, NPI, DFM, OSAT Process Development, SMT, Underfill, Die Attach, Wire Bond, Molding, Dicing Saw, Laser, Sputter Thin Film, Mechanical Design, GD&T, Tolerance Analysis

Industry

Computers and Electronics Manufacturing

Description

Apple is where individual imaginations gather together, committing to the values that lead to great work. Every one of us shares a belief that we can make something wonderful and share it with the world, changing lives for the better. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Here, you’ll do more than join something — you’ll define something. As a part of SiP process NPI team, you will interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new System-in-Package (SiP) technologies. We are looking for individuals who are innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing. DESCRIPTION As a DFM SiP/ PCBA NPI engineer, you will play a crucial role in developing next generation SiP process and PCBA assembly process for various of end products. You will be deeply involved from early design phase , prove-of-concept phase (POC), multiple NPI build phases, and hand over to MP team until risk ramp. During these phases, you will be the key stakeholder to lead OSAT’s process team for process development & qualification per projects assigned.This role partners closely with cross-functional engineering teams, suppliers, and factory operations to support NPI, equipment development, and high-volume manufacturing while meeting quality, cost, and delivery objectives. MINIMUM QUALIFICATIONS Bachelors or Masters degree in Mechanical engineering, Physics, Materials Science or equivalent 5 years of experience in IC packaging / Surface Mount Technology / Printed Circuit board assembly process Solid knowledge / experience in overall SiP process, panel level packaging process or wafer level packaging process, including SMT (surface mounting technology), underfill, die attach, wire bond, molding, dicing saw, Laser and sputter thin film materials Strong knowledge of SMT Processes, mechanical design, GD&T, Tolerance Analysis PREFERRED QUALIFICATIONS Extensive experiences about transfer molding with fine pitch IC or sputter thin film processes for EMI shielding, in the context of high-volume semiconductor/packaging/electronics manufacturing Proven ability to lead internal or external team for assembly process development and qualification of semiconductor packages Good understanding and skill for material characterizations, semiconductor packaging, component failure analysis, design for experiments, mechanical simulation and data analysis (JMP) Ability to work under pressure with a wide range of people with varying degrees of experience Familiar with quality tools, including SPC, Cpk, data distribution, data correlation, commonality study and etc Excellent communication skills in English

Responsibilities

This role involves developing next-generation System-in-Package (SiP) and Printed Circuit Board Assembly (PCBA) processes from early design through high-volume manufacturing handover. The engineer will lead external supplier process teams for development and qualification while partnering with cross-functional teams to meet quality, cost, and delivery objectives.