Product Integration Lead, HIG High Bandwidth Memory at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

05 Apr, 26

Salary

0.0

Posted On

05 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Product Development, Engineering, Collaboration, Technical Issue Resolution, HBM Knowledge, Communication, Presentation Skills, Risk Assessment, Programming, Python, Java, C, VB, Tableau, PowerBI, DRAM Knowledge

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Integration Lead in the HIG HBM Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge HBM products into end-system requirements. You will be the key representative driving HBM development swimlane requirements (SCD) to meet end-systems needs. With a deep understanding of both HBM and System capabilities, you will set Product Development priorities and manage new change initiative requests to meet rapidly evolving customer demans with agility. You will drive resolution of technical challenges in the development cycle, identifying opportunities to ensure HBM solutions are executed within the boundary of development schedule, risks and incremental development costs. Key Responsibilities include, but are not limited to: Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD). Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging and Global Quality Teams to achieve competitive systems and resolve any gaps between HBM commit and system requirements. Understand sample usage and any gaps in capability to system requirements, managing HBM sample delivery in sync with system development needs and timelines. Assist with risk assessment of identified issues. Lead Triage Team for any System or Chip Feature Interaction requiring clarity of failure ownership domain. Coordinate mitigations with key stakeholders. Manage Qualification Definition and Changes, driving the Change Control Board for Late/Post Qual Changes. Communicate proper priorities within HBM Development team to maintain focus on achieving system specs and address concerns with Component and System teams. Key Requirements: Bachelor’s Degree or Master’s Degree in Electrical or Computer Engineering. 10+ years of demonstrated ability in Product, Design, Process, Yield Enhancement, or related engineering fields. Experience with product development projects is preferred. Programming skills in python/ java/ C/VB . And tableau and PowerBI development experience is plus. Proven capability to lead technical issues to closure with creative, effective solutions through a highly collaborative approach. Desire to develop knowledge and expertise in overall HBM to System development. Knowledge of DRAM/HBM device/design and system management is beneficial. Excellent interpersonal, communication and presentation skills to gather technical information from engineering key stakeholders and drive technical issue resolution/mitigation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The Product Integration Lead will manage technical inputs and drive alignment on requirements for HBM products. They will collaborate with various teams to resolve gaps between HBM commitments and system requirements while managing sample delivery and technical challenges.