Production Specialist (Wire Bond) | 2nd Shift at Microchip Technology Inc Japan

Mount Holly Springs, Pennsylvania, United States -

Full Time

Start Date

Immediate

Expiry Date

20 Feb, 26

Salary

0.0

Posted On

22 Nov, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Attention To Detail, Machine Operation, Quality Control, Process Optimization, Documentation, Collaboration, Safety Compliance, Multi-tasking, Communication, Adaptability, Listening Skills, Basic Computer Skills, Math Skills, Reading Comprehension, Teamwork, Individual Work

Industry

Semiconductor Manufacturing

Description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: Microchip Technology Inc. is a market leader in designing, manufacturing, and marketing Frequency Control, Sensor, and Hybrid Product solutions using the latest cutting-edge techniques. For over 70 years, our facility has provided solutions for Satellite Constellations, Deep Space Exploration Missions, Military Systems, GPS, Communication Networks, and much more. Our Production Specialist (Wire Bond) employees are machine operators who perform wire bonding operations in the production of our crystal oscillators. You may be a good fit if you have hobbies related to sewing, crocheting, cross-stitching, and related activities! Just as sewing requires precision in stitching fabric together, a wire bonder requires the same careful attention to detail when making bonds. If you have a desire to learn, strong hand eye dexterity, and a quality mindset, this could be a great position for you! Experience is preferred but not necessary as on the job training is provided! Key Responsibilities: Wire Bonding Operations: perform fine wire bonding using various bonding techniques (e.g., thermosonic and hypersonic) on crystal oscillator components, ensuring proper placement and electrical connectivity. Equipment Operation: Set up, calibrate, and operate wire bonding machines (e.g., wedge bonder, ball bonder) to meet production requirements and specifications. Quality Control: Inspect completed wire bonds for quality assurance, ensuring compliance with internal and industry standards. Identify and troubleshoot defects such as voids, misalignments, and non-conformances. Process Optimization: Monitor wire bonding processes to identify opportunities for improving efficiency, yield, and reliability. Recommend and implement process improvements. Documentation: Maintain accurate records of production runs, wire bonding parameters, and inspection results. Collaboration: Work closely with engineering and production teams to troubleshoot issues, implement process changes, and ensure production schedules are met. Safety and Compliance: Adhere to all safety protocols and company policies. Ensure that work is carried out in a clean, safe, and organized environment. Requirements/Qualifications: Ability to multi-task while paying careful attention to detail Prior success working both individually and in a team environment Good written and verbal communication skills Ability to follow written and verbal direction Ability to read, comprehend and follow detailed work specifications Excellent listening skills Adaptability to frequent change and improvements Regular and predictable attendance is essential Ability to wear the required Protective Equipment Basic computer, math and reading comprehension skills You must be 18 years old with a high school diploma or GED Preferred Qualifications: Technical certification or associates degree in electronics or related field. Previous manufacturing experience. Proficiency with wire bonding machines and related tools/materials. Knowledge of semiconductor and crystal oscillator assembly processes. Six Sigma or Lean Manufacturing knowledge Schedule: M-F, 3:30pm-12am Benefits: To reflect and honor how essential our team is, they have access to all the following benefits: 2 weeks of Vacation AND 2 weeks of Personal (Waiting period may apply) 10 Paid Holidays Quarterly Bonuses Restricted Stock Units & Employee Stock Purchase Plans Medical, Dental, Vision, and Legal Benefits on Day 1 401k & Company Match Tuition Reimbursement Onsite Fitness Room U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3). Travel Time: No Travel Physical Attributes: Carrying, Crouching, Feeling, Foot Controls, Handling, Hearing, Kneeling, Lifting, Noise and/or vibration, Other, Pulling, Pushing, Reaching, Seeing, Talking, Works Alone, Works Around Others Physical Requirements: Able to lift, push, pull 10 lbs; carry 10lbs; sit 80%; stand 10%; walk 10% standing; must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, work alone, work around others Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster. To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes. At Microchip, employees are our greatest strength. As one of the top performing semiconductor companies in the world, we are led by a set of guiding values and a mission to empower innovation to enhance the human experience. We work tirelessly to create a company culture that highlights how important every employee is to our mission. Microchip Recruitment Privacy Notice Recruitment Scam Alert Microchip will never: Request banking or payment information during the application or interview process. Ask candidates to register or pay for a training class as part of the application or interview process. Ask candidates to receive or ship packages or goods as part of the recruitment process. Use email address not ending with "@microchip.com". Use instant messaging to communicate. Be wary of generic emails or vague job details. If something feels suspicious, stop communicating immediately. To report potential scams, contact us at HR.Compliance@microchip.com.

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Responsibilities

The Production Specialist (Wire Bond) performs wire bonding operations on crystal oscillator components, ensuring proper placement and electrical connectivity. They also set up and operate wire bonding machines while monitoring processes for efficiency and quality control.