Start Date
Immediate
Expiry Date
03 Feb, 26
Salary
0.0
Posted On
05 Nov, 25
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Project Management, Semiconductor Packaging, Process Integration, Technology Development, Cross-Functional Leadership, Hybrid Bonding, CoWoS, Chiplet Integration, Communication Skills, Stakeholder Management, IIoT Hardware Deployment, APC Systems, Simulation Modeling, Yield Enhancement, Defectivity Analysis, Continuous Improvement
Industry
Semiconductor Manufacturing