OUR MISSION

QuantWare is the world’s leading manufacturer of superconducting quantum hardware. As a high growth start-up with a global customer base, our mission is to accelerate the advent of the quantum computer. We push the boundaries of what’s possible in our field. We work on making the world’s largest quantum processors, as fast as possible.
At QuantWare, we’re not just producing quantum hardware for the hyperscalers of tomorrow; we’re working on technology that will change the world. To make that ambition a reality, we need exceptional people who drive real impact. That’s where you come in!

ABOUT US

QuantWare is the world’s leading manufacturer of superconducting quantum hardware. We are a high-growth start-up on a mission to accelerate the advent of the quantum computer. Our team of around 50 smart, ambitious colleagues from all over the world thrives in a dynamic and collaborative environment. Our mission is to accelerate the advent of the quantum computer. We design, develop and fabricate state-of-the-art Quantum Processor Units. We are extremely motivated to solve hard problems and make useful quantum computation a reality.
As part of our recruitment process, candidates may be required to undergo pre-employment screening

IMPACT OF THE ROLE

Set the trajectory for our next quantum processor by collaborating with multidisciplinary teams to ensure design and fabrication of qubit chips are aligned with 3D architecture development. Your contributions will be instrumental in realizing our vision of delivering quantum processors with over 1000 qubits, empowering both our customers cutting-edge research and our internal quest for a scalable quantum computer.
If you’re passionate about tackling the most challenging problems at the intersection of quantum physics and engineering, join us in unlocking the full potential of quantum computing!

WHAT YOU’LL BE DOING

As QuantWare’s new Quantum 3D Integration Engineer, you will:

• Pioneer new methods for scaling the number of qubits in a processor, exploiting novel 3D integration techniques like through-silicon vias, flip-chip bonding and package mode mitigation; like through-silicon vias, flip-chip bonding and package mode mitigation;
• Collaborate closely with chip designers and fabrication experts to ensure seamless integration of qubit chips into the 3D architecture, while maintaining high yield;
• Conduct rigorous testing and validation to verify the performance and reliability of 3D integrated quantum systems;
• Stay abreast of the latest advancements in quantum computing, 3D integration technologies, and related fields, applying this knowledge to continually enhance our approaches and methodologies.