YOUR EXPERIENCE INCLUDES:

• PhD degree in Materials Science, Physics, Electrical Engineering, Chemical Engineering or related science and engineering fields with 0-2 years of direct industry experience or MSc. Degree in same with 5+ years of industry experience
• Strong hands-on experience and in-depth understanding of nanoscale device fabrication and associated wafer process and measurement systems
• Expertise in thin film, surface, interface and nanostructure characterization techniques (e.g. AFM, XPS, contact angle, FIB, SEM, (S)TEM, TDTR, etc)
• Familiarity with platforms for modeling, simulating or visualizing wafer processes, structures, and physical device responses (preferred but not essential)
• Experience / knowledge of next generation Advanced Integration techniques, to improve device performance and reduce cycletime.

COMPLETED APPLICATIONS SHOULD BE SUBMITTED NO LATER THAN MIDNIGHT ON TUESDAY, 30TH SEPTEMBER 2025

This is a Full-Time position working 39 hours per week.
Please demonstrate on your Cover Letter or CV how you meet the criteria set out in the job description identified above.
Testing may be used as part of the selection process.
At Seagate we are committed to building a diverse, inclusive and authentic workplace. To see all vacancies that Seagate has available, please sign up - Register your interest for career updates with our Talent Network and to be considered for future opportunities: Seagate Careers

SPRINGTOWN, NORTHERN IRELAND

Our Springtown site is Derry/Londonderry’s largest manufacturer, we’re proud that Seagate is a flexible and inclusive place to work. We have more than 1,400 employees spanning research and development, manufacturing, and other functions.
Here at work, you can grab breakfast, lunch, dinner and snacks at our subsidized on-site cafe.
Looking for an active break from your workday? We’ve got you covered. Take a group or individual exercise class during lunch or after work at our on-site gym.
Network with your colleagues through the Young Professionals Network, Women’s Leadership Group, the Carers Café (for caregivers of individuals with disabilities), Volunteer in the community with our support! Join our creative network, which includes a choir, foreign language classes and even a cookery class!
Join our Employee Resource Groups (ERG), a voluntary, employee-led community built on a shared diversity identity and/or an appreciation of that identity, open to ALL current employees at Seagate!

YOUR EXPERIENCE INCLUDES:

• PhD degree in Materials Science, Physics, Electrical Engineering, Chemical Engineering or related science and engineering fields with 0-2 years of direct industry experience or MSc. Degree in same with 5+ years of industry experience
• Strong hands-on experience and in-depth understanding of nanoscale device fabrication and associated wafer process and measurement systems
• Expertise in thin film, surface, interface and nanostructure characterization techniques (e.g. AFM, XPS, contact angle, FIB, SEM, (S)TEM, TDTR, etc)
• Familiarity with platforms for modeling, simulating or visualizing wafer processes, structures, and physical device responses (preferred but not essential)
• Experience / knowledge of next generation Advanced Integration techniques, to improve device performance and reduce cycletime.

COMPLETED APPLICATIONS SHOULD BE SUBMITTED NO LATER THAN MIDNIGHT ON TUESDAY, 30TH SEPTEMBER 2025

This is a Full-Time position working 39 hours per week.
Please demonstrate on your Cover Letter or CV how you meet the criteria set out in the job description identified above.
Testing may be used as part of the selection process.
At Seagate we are committed to building a diverse, inclusive and authentic workplace. To see all vacancies that Seagate has available, please sign up - Register your interest for career updates with our Talent Network and to be considered for future opportunities: Seagate Careers

SPRINGTOWN, NORTHERN IRELAND

Our Springtown site is Derry/Londonderry’s largest manufacturer, we’re proud that Seagate is a flexible and inclusive place to work. We have more than 1,400 employees spanning research and development, manufacturing, and other functions.
Here at work, you can grab breakfast, lunch, dinner and snacks at our subsidized on-site cafe.
Looking for an active break from your workday? We’ve got you covered. Take a group or individual exercise class during lunch or after work at our on-site gym.
Network with your colleagues through the Young Professionals Network, Women’s Leadership Group, the Carers Café (for caregivers of individuals with disabilities), Volunteer in the community with our support! Join our creative network, which includes a choir, foreign language classes and even a cookery class!
Join our Employee Resource Groups (ERG), a voluntary, employee-led community built on a shared diversity identity and/or an appreciation of that identity, open to ALL current employees at Seagate!

ABOUT THE ROLE - YOU WILL:

Join our cutting-edge research and development team in our state-of-the-art clean room fabrication facility. Utilizing the latest manufacturing processes and design tools, you will develop novel, robust and manufacturable methods to integrate novel metal and dielectric thin film structures into nanometer scale devices to meet our product roadmap’s performance and reliability requirements. You will play a key role, interacting with semiconductor tool vendors and universities, in order to identify new opportunities and Advanced Integration techniques that will help deliver Seagate’s future processes, evolve the manufacturing line to enable faster delivery of next generation HDD products. This is a full-time, on-site position, working 39 hours per week from Monday to Friday.

KEY RESPONSIBILITIES:

• Develop novel, robust, and manufacturable methods to integrate novel metal and dielectric thin film structures into in nanometer-scale head devices
• Investigate surface preparation and interface processing techniques to ensure stable and predictable operation of new materials under device operating conditions
• Perform material characterization to ensure device compatibility and performance
• Collaborate with unit process owners (lithography, deposition, etch, wet process, metrology) to achieve prototype device wafer build flows capable of meeting design intent
• Help assess the impact of new integration schemes on downstream head performance
• Partner with wafer capital equipment suppliers to define hardware paths needed for advanced integration capability and manufacturability
• Participate in technology transfers to the product development engineering team
• Manage and analyse datasets to correlate experimental results with device performance and reliability.
• Contribute to Seagate’s IP portfolio in the form of invention disclosures, patents, trade secrets, peer-reviewed journal articles, and/or white papers.

ABOUT THE ROLE - YOU WILL:

Join our cutting-edge research and development team in our state-of-the-art clean room fabrication facility. Utilizing the latest manufacturing processes and design tools, you will develop novel, robust and manufacturable methods to integrate novel metal and dielectric thin film structures into nanometer scale devices to meet our product roadmap’s performance and reliability requirements. You will play a key role, interacting with semiconductor tool vendors and universities, in order to identify new opportunities and Advanced Integration techniques that will help deliver Seagate’s future processes, evolve the manufacturing line to enable faster delivery of next generation HDD products. This is a full-time, on-site position, working 39 hours per week from Monday to Friday.

KEY RESPONSIBILITIES:

• Develop novel, robust, and manufacturable methods to integrate novel metal and dielectric thin film structures into in nanometer-scale head devices
• Investigate surface preparation and interface processing techniques to ensure stable and predictable operation of new materials under device operating conditions
• Perform material characterization to ensure device compatibility and performance
• Collaborate with unit process owners (lithography, deposition, etch, wet process, metrology) to achieve prototype device wafer build flows capable of meeting design intent
• Help assess the impact of new integration schemes on downstream head performance
• Partner with wafer capital equipment suppliers to define hardware paths needed for advanced integration capability and manufacturability
• Participate in technology transfers to the product development engineering team
• Manage and analyse datasets to correlate experimental results with device performance and reliability.
• Contribute to Seagate’s IP portfolio in the form of invention disclosures, patents, trade secrets, peer-reviewed journal articles, and/or white papers.