R&D Engineer-Semiconductor Packaging at Keysight Technologies - Hong Kong

Santa Rosa, California, United States -

Full Time

Start Date

Immediate

Expiry Date

26 May, 26

Salary

0.0

Posted On

25 Feb, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Mechanical Engineering, Conceptual Design, Thermal Analysis, Prototype Development, Supplier Management, Quality Requirements, Regulatory Requirements, Mechanical Architecture, Sheet Metal Design, Custom Machining, Die Casting, Injection Molding, Rapid Prototyping, Mechanical Modeling, 3D CAD, Thermal Modeling

Industry

electrical;Appliances;and Electronics Manufacturing

Description

Overview Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. As an R&D Mechanical Engineer you will be part of Keysight Lab’s mm-Wave subsystems design group. Partnering with our Centers of Excellence and Industry Solutions Groups, we develop leading mm-wave front-end products and interconnect that address a variety of market applications (Advanced Communication, Automotive Radar, Aerospace/Defense). This position is your opportunity to join a team that's bringing to market some of the most advanced electronic packaging and interconnect solutions in the world. These solutions will shape Keysight’s future product architectures and deliver new measurement capability. You will apply your mechanical engineering skills to all phases of the development process including conceptual design, thermal analysis, prototype development, working with suppliers, and ensuring that your designs meet Keysight's quality/regulatory requirements. While part of this team, you will also be working independently on your priorities and tasks, the scope and complexity of which will be based on your existing knowledge and capabilities as well as how fast you can acquire new skills. Responsibilities In this position you will: Develop next generation packaging platforms for high performance electronic products Lead the mechanical architecture and definition of new products and own all phases of the mechanical design process from concept to production ensuring that the product meets performance and manufacturability goals and reliability qualifications requirements. Design mechanical components which include sheet metal, custom machining, die casting, injection molding and rapid prototyping. Develop thermal and mechanical models to solve challenging thermal issues. Work within a multi-discipline project team to create new products and ensuring new designs meet both the Internal and Customer Requirements. Work with our internal and external manufacturing partners to prototype designs and bring them to manufacturing. Qualifications Job qualifications: BS, MS, PhD in Mechanical Engineering or equivalent with the ability to employ both a hands-on and analytic approach to problem solving. Ability to multi-task in a fast paced and demanding product development environment and balance engineering decisions with schedule, material cost, and manufacturability. A broad understanding of various mechanical fabrication processes (machining, die casting, plastic molding, sheet metal), engineering materials and electronics packaging solutions. Minimum of 8-10 years of experience in electronics packaging process/product development Experience with Mechanical design tools (3D CAD, Thermal Analysis); experience with Siemens NX and Teamcenter a plus, as well as experience with ANSYS structural and thermal and Celsius Thermal Solver. Excellent written and verbal skills to be able to work across multiple functions and drive development. Ability to navigate ambiguity and a dynamic environment and generate innovativ ideas. Anticipate problems and adjust accordingly. Solid foundation of engineering fundamentals Good listening and communication skills Candidates must be local or willing to relocate to Santa Rosa, CA This position requires access to certain goods, software, technology, or technical data subject to U.S. export control laws and regulations. Under these laws and regulations, U.S. persons (which includes U.S. citizens, U.S. nationals, lawful permanent residents, refugees, and asylees) working for Keysight can access export-controlled items without authorization from the U.S. government. For any individual who is not a U.S. person, Keysight may need authorization from the U.S. Department of State, U.S. Department of Commerce, or other appropriate federal agency before the individual can access export-controlled items. Candidates must be a U.S. citizen or lawful permanent resident of the U.S., or protected individual, having authorization from the U.S. government for export-controlled items under 8 U.S.C. 1324b(a)(3). Careers Privacy Statement Keysight Technologies Inc. is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws. The level of role and salary will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below. California Pay Range: MIN $149,850 - MIDPT $199,800 - MAX $249,750 Note: For other locations, pay ranges will vary by region. This role is eligible for Keysight Results Bonus Program US Employees may be eligible for the following benefits: - Medical, dental and vision - Health Savings Account - Health Care and Dependent Care Flexible Spending Accounts - Life, Accident, Disability insurance - Business Travel Accident and Business Travel Health - 401(k) Plan - Flexible Time Off, Paid Holidays - Paid Family Leave - Discounts, Perks - Tuition Reimbursement - Adoption Assistance - ESPP (Employee Stock Purchase Plan) #LI-MED1

Responsibilities

The role involves developing next-generation packaging platforms for high-performance electronic products, leading the mechanical architecture, and owning the design process from concept to production to meet performance and reliability goals. Responsibilities include designing various mechanical components, developing thermal and mechanical models, and collaborating with multi-discipline teams and manufacturing partners.