R&D Mechanical Design Engineer at MIT SEMICONDUCTOR PTE LTD
Singapore, , Singapore -
Full Time


Start Date

Immediate

Expiry Date

22 Nov, 25

Salary

4500.0

Posted On

23 Aug, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Structural, Sizing, Design, Machine Design, Solid Modeling, Kinematics, Circuit Design, Mechanism Design, Assembly Drawings, Material Selection, Solidworks

Industry

Mechanical or Industrial Engineering

Description

EDUCATION AND EXPERIENCE

  • BE/BS Mechanical Engineering.
  • 0-3 years experience in designing and developing automated equipment.
  • 3D solid modeling, preferably Creo (others like Solidworks, NX are also acceptable).
  • Electro-mechanical module conceptualization and design.
  • Pneumatic/fluid circuit design.
  • Detail fabrication drawings, assembly drawings and layout drawings.
  • Selection and sizing of standard components available off the shelf.

Preferred experience

  • Ultra high-precision machine design.
  • High-speed pick and place mechanism design.
  • Structural, kinematics and dynamic analyses and FEA simulations.
  • Geometrical tolerancing and dimensional analyses.
  • Engineering material selection.
  • Manufacturing process selection.
  • Application of analysis tools like FMEA, DOE.
Responsibilities

Design and develop high-precision semiconductor equipment to meet the processing and automation needs of customers. To succeed in this position, you need to:

  • Understand the design specification given to you by the design lead.
  • Understand the company’s design standards and best practices.
  • Understand the constraints within which your design must work.
  • Understand geometric tolerances and dimensional analyses.
  • Choose components based on an understanding of function, reliability, and costs.
  • Choose materials based on an understanding of materials science and engineering.
  • Understand design for manufacturability/assembly.
  • Work with the Electrical Engineer to choose drives and electrical components (if any).
  • Discuss with the Software Engineer on any interlocking logic requirements.
  • Lay the design concept down in the 3D CAD.
  • Perform DFMEA during the design process.
  • Submit the CAD module to the system integrator to check for interface issues.
  • Review the design with the design lead.
  • Put the part designs down on drawings, carefully specifying tolerances and specifications.
  • Build the module BOM.
  • Procure the module components.
  • Review the assembly of the physical module.
  • Perform design improvements where appropriate.
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