DO YOU WANT TO MAKE AN IMPACT IN THE FIELD OF CHIP PACKAGING?

And do you want to contribute to innovative hightech projects that help our customers build up a lasting lead in the world of technology? While at the same time you will be working for a company where you and your personal development are our priority? Then you are the candidate we are looking for!

WANT TO KNOW MORE?

Do you want to know more about what you’re going to do as R&D scientist? Then contact David Dilien via T: +31 6 46 09 39 98 E: david.dilien@enter-group.nl

As a key member of our team, you will develop advanced chip packaging technologies for a wide range of high-end applications, from automotive radar to photonics and power electronics. You will be involved in the design, realization, and characterization of next-generation advanced packages. Working at the intersection of material science, packaging technology, and microelectronics, you will thrive in a multidisciplinary research environment alongside industry partners. Your work will include conducting experiments and modelling to develop and demonstrate novel processes, with a strong focus on manufacturability and reliability. Additionally, you will engage directly with customers, translating industry needs into technology development.
Please note: This role is primarily based in Nijmegen, but you will also work occasionally in Eindhoven ( 1 or 2 days a week)

Responsibilities:

• Design, fabricate, and conduct reliability testing of advanced packages
• Participate in technology and process development, and generate IP
• Contribute expertise and take responsibility in projects with (international) customers