Resident Engineer for Assembly for MEMS Sensors (1st Level Packaging) at Bosch Group

Taguig, Metro Manila, Philippines -

Full Time

Start Date

Immediate

Expiry Date

29 Apr, 26

Salary

0.0

Posted On

29 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

MEMS Assembly, Interconnect Technologies, Packaging Processes, Material Selection, Machine Selection, Supplier Qualification, Process Development, Technical Documentation, Team Collaboration, Problem Solving, Creativity, Initiative, Flexibility, Leadership, Agility

Industry

Software Development

Description

Company Description At Bosch, we shape the future by inventing high-quality technologies and services that spark enthusiasm and enrich people’s lives. Our promise to our associates is rock-solid: we grow together, we enjoy our work, and we inspire each other. Join in and feel the difference. Robert Bosch Inc. (Philippines) has diversified businesses in Power Tools, Automotive Aftermarket, Automotive Original Equipment, Building Technologies, Thermotechnology, and Drive and Control Technology (Bosch Rexroth). Additionally, the company’s Packaging Technology and Home Appliances businesses are represented through appointed local agents. In 2017, Bosch generated sales of USD 51 million (45 million euros) in the Philippines. Bosch continues to build its nationwide network as a socially responsible provider of innovative and beneficial technologies to the Philippines. Job Description We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs, machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices. Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier. Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages. Part of an interdisciplinary product development team with customer representatives, purchasing, MEMS design and technology, reliability, testing, simulation, construction, production, and quality team members. Responsible for the material and machine selection and associated process development for core assembly steps. Selecting and qualifying new suppliers (assembly subcons, equipment and raw material suppliers). Co-working with equipment suppliers to enhance existing or to develop new machines. Take care of the development, qualification, and transfer to mass production of new assembly processes and materials. Owner of specifications and technical documentation concerning the optical MEMS package, assembly process, and raw materials. Qualifications Education: Master or Bachelor degree in material or natural science (physics, chemistry), or mechanical / electrical engineering or material science. Experience and Skills: Minimum of 3 years, preferred 7 years of experience in sensor and/or package development. Knowledge and skills in EOL assemble handling, BGA, QFN, LGA, MEMS packages, FOL, EOL assembly, FMEA, SPC, and 8D. Personality: team player, problem solver, broad technical interests, creativity, initiative, autonomy, flexibility, leadership, agility, with ability to work with minimum supervision. Languages: Very good English skills in speaking and writing. Intercultural Skills: Willingness to travel. Additional Information Your future job offers you. Flexible work time, medical services, and benefits & services. Legal Entity: ROBERT BOSCH INC.

Responsibilities

The Resident Engineer will develop and characterize new optical MEMS device packages and work closely with industry-leading OSATs and suppliers. They will also be responsible for material and machine selection, process development, and the transfer to mass production of new assembly processes.