We are seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join our cutting-edge fabrication team. In this role, you’ll work on the forefront of 3D chip stacking and flip-chip hybridization, building integrated devices that form the heart of next-generation electronic systems. This is your opportunity to work hands-on with state-of-the-art hybridization equipment, contributing directly to breakthrough innovations in device performance and packaging efficiency.
Location: Shoreview, MN
Wage: $33 – $47/hr ($68,500 – $97,800/year), depending on experience
Hours: 1st shift | Monday – Friday | 7:30 am – 3:30 pm

REQUIREMENTS OF THE SEMICONDUCTOR ADVANCED PACKAGING ENGINEER:

• Bachelor’s or Master’s in Physics or Engineering (required)
• Interest in advanced packaging and hybridization
• Experience with deposition or etch equipment (preferred)
• Flip-chip or 3D packaging experience is a plus

• Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes
• Run and support fab tools like evaporation, sputtering, or RIE as needed
• Perform process QC to maintain high yield and product quality
• Document, troubleshoot, and improve processes
• Work with engineering teams to scale operations and build future team capability