Senior Engineer Development at Infineon Technologies

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

07 Aug, 26

Salary

0.0

Posted On

09 May, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

AutoCAD, Inventor, Cadence, 2D/3D Drafting, GD&T, Material Physics, Semiconductor Packaging, Lead Frame Design, Substrate Design, Packing Material Design, Analytical Skills, Problem Solving

Industry

Semiconductor Manufacturing

Description

Technical expert for lead frame / Substrates / packing material in package development projects. Your Role Key responsibilities in your new role Perform design, drawing and specification for lead frame / substrates based on design guideline, assembly rules and ensure design for manufacturing, quality and cost. Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost. Drive lead frame / substrates / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM). Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame / substrates / packing material; and qualification release. Establish design guideline / requirement for lead frame / substrates/ packing material specification. Generate technical papers / journals and patents related to leadframe design / substrates / package design that enhances technical value. Your Profile Qualifications and skills to help you succeed Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 3 years of working experience in semiconductor assembly and packaging development; and relevance experience in Lead Frame /substrate / Packing Material is prefered. Drafting / desigining (2D/3D) Lead Frame using AutoCAD / Inventor /Cadence. Knowledge in material physics / properties for Lead Frame / substrates and packing material. GD&T knowledge / material specification definition. Analytical and problem solving skills. Basic semiconductor packaging, assembly and test. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

The role involves designing and specifying lead frames, substrates, and packing materials to ensure manufacturing quality and cost-efficiency. The engineer will drive development activities, manage project milestones, and generate technical papers or patents.