Senior Engineer I -Process at Microchip Technology Inc Japan

, , Philippines -

Full Time

Start Date

Immediate

Expiry Date

24 Jun, 26

Salary

0.0

Posted On

26 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wafer Dicing, Singulation Process, Process Stability, SPC, Equipment Capability, Blade Optimization, Problem Solving, Process Characterization, Recipe Creation, Yield Analysis, Defect Analysis, DOE, PFMEA, MSA/GR&R, WLCSP, Advanced Packaging

Industry

Semiconductor Manufacturing

Description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: Backend Process Engineer owns the wafer dicing/singulation process to meet yield, quality, cost, and output targets. The role is accountable for process stability (SPC), equipment capability, blade/consumables optimization, and rapid problem-solving for saw-related defects. Job Description: Establish, maintain, and improve saw process parameters (feed rate, spindle speed, blade exposure, cut depth, coolant flow, dressing) to hit quality metrics (chipping, kerf width, die strength) Implement and monitor SPC charts for critical parameters and outputs; trigger and lead containment and corrective actions for OOC/OOS signals Define golden sample criteria, cut recipes, and recipe management controls Analyze yield loss and defect paretos (edge chipping, front/backside chipping, edge crack, burrs, delamination, blade loading, overheating) Lead structured problem solving (5-Why, Ishikawa, DMAIC), run DOEs, and implement sustainable corrective/preventive actions Drive blade selection and life optimization; manage kerf control and saw mark quality Collaborate with equipment engineers for uptime/OEE improvement, PM optimization, and capability enhancement Qualify new blades, hubs, coolants, and dressers; manage vendor trials and cost-per-cut optimization Requirements/Qualifications: Minimum of 5 years experience in semiconductor wafer dicing/saw process, back‑end assembly, or related manufacturing environment Understanding of wafer saw/dicing equipment operations (DISCO, ADT, or equivalent) Familiarity with process characterization, recipe creation, and equipment or process troubleshooting Understanding of blade characteristics (grit, bond, concentration) and their impact on performance Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies. Strong analytical and problem-solving skills; ability to interpret SPC charts and process data. Good communication skills and ability to work in a team-oriented environment. Knowledge of safety protocols and cleanroom practices. Strong experience with WLCSP or advanced packaging tools is highly preferred Proficiency in MS Office and maintenance management systems. Strong analytical and problem-solving skills Leadership and mentoring capability Good communication and teamwork skills High attention to detail and sense of accountability Travel Time: 0% - 25% To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes. At Microchip, employees are our greatest strength. As one of the top performing semiconductor companies in the world, we are led by a set of guiding values and a mission to empower innovation to enhance the human experience. We work tirelessly to create a company culture that highlights how important every employee is to our mission. Microchip Recruitment Privacy Notice Recruitment Scam Alert Microchip will never: Request banking or payment information during the application or interview process. Ask candidates to register or pay for a training class as part of the application or interview process. Ask candidates to receive or ship packages or goods as part of the recruitment process. Use email address not ending with "@microchip.com". Use instant messaging to communicate. Be wary of generic emails or vague job details. If something feels suspicious, stop communicating immediately. To report potential scams, contact us at HR.Compliance@microchip.com.

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Responsibilities

The Backend Process Engineer is responsible for owning the wafer dicing/singulation process to meet yield, quality, cost, and output targets, focusing on process stability, equipment capability, and rapid problem-solving for saw-related defects. This includes establishing and improving saw process parameters, implementing SPC monitoring, analyzing yield loss, leading structured problem-solving efforts, and driving blade/consumables optimization.