Senior Engineer, Packaging Engineering (Die Prep) at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

29 Dec, 25

Salary

0.0

Posted On

30 Sep, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Problem-Solving Skills, Root Cause Analysis, Design Of Experiment, Failure Mode Effects Analysis, Statistical Process Control, Project Planning, Quality Assurance, Communication Skills, Interpersonal Skills, Process Development, NPI Engineering, Semiconductor Assembly Processes, Machine Learning, Artificial Intelligence, 6 Sigma Certification, Minitab, JMP

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing. ESSENTIAL DUTIES AND RESPONSIBILITIES: New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material qualifications, new machine qualifications and new process qualifications. Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing, tape & reel), perform complete window study, DOEs, corner limits. Golden recipe setup for new package qualification. Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets. Process transfer from Development to New product Introduction team & from site to site. Work closely with Cross site’s Product development & design team to understand the Package Design Rules & Requirements. Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology. Qualifications REQUIRED: Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, & etc) Min 2 years of working experience in Semiconductor Process development Process engineering/ NPI engineering background Knowledge in Semiconductor assembly processes PREFERRED: Min 4 years of working experience in Semiconductor Process development Process engineering/ NPI engineering background with either one of the processes below: wafer thinning/ backgrinding, Mechanical dicing, laser dicing/ laser grooving, wafer inspection/ Automatic optical inspection, stealth dicing Innovative, have patent disclosure will be an added advantage. Knowledge in Artificial Intelligent and machine learning, an added advantage Experience in Process transfer from Development to New product Introduction team & from site to site SKILLS: Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology Knowledge of Design Of Experiment (DOE) Familiarize with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP Good project planning, strong sense of quality and urgency Team leads with good communication and interpersonal skills. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected].

Responsibilities

The Senior Engineer will be responsible for Die Prep New Process Development and Equipment solutions to meet various targets supporting New Product Introduction. This includes process qualification, recipe setup, and collaboration with cross-site teams.