Senior Engineer, Packaging Engineering (Mechanical Development) at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

18 Aug, 26

Salary

0.0

Posted On

20 May, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

SolidWorks, FMEA, 8D, DMAIC, JMP, Minitab, SolidWorks Flow Simulation, Design of Experiments, Root Cause Corrective Action, DFMA, DFMEA, Tolerance Stack-up Analysis, Metrology, Failure Analysis, CNC Milling, Injection Molding

Industry

Semiconductor Manufacturing

Description

Company DescriptionSandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum efficacy.Design and implement rigorous engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for complex problem-solving and data-driven decision-making processes.Execute thorough factory Design for Mechanical Assembly and Automation (DFMA) evaluations for Solid-State Drive (SSD) assembly through meticulous examination of Design Packages, including design concepts, tolerance stack-up analyses, and Design Failure Mode and Effects Analysis (DFMEA). Actively participate in the design of machines and fixtures to enable optimal process performance.Design SSD (Solid-State Drive) assembly jigs / fixtures by developing new concepts, performing reverse engineering, and creating mechanical drawings to support daily mechanical assembly and technical staging activities.Oversee the development and implementation of comprehensive Product Qualification Packages during the development phase, encompassing product specifications, packaging requirements, mechanical drawings, supplier Design for Manufacturability (DFM) guidelines, and Quality Management Plans (QMP) for each qualified product.Spearhead specialized engineering characterization activities, lead strategic cost reduction projects, and provide critical support for factory emergency taskforce operations as required.QualificationsREQUIRED:Bachelor's Degree in Mechanical Engineering or related disciplines is mandatory. Academic studies must be in an applicable field of engineering or science, demonstrating a record of scholastic excellence.Candidates with 3-8 years of professional experience in an engineering role within the semiconductor and automation industry will be given preferential consideration.Proven ability to swiftly analyze and resolve complex engineering challenges through innovative approaches, demonstrating a clear understanding of efficiency and resource optimization.Exceptional skill in synthesizing and presenting complex design concepts and data sets to both technical and non-technical audiences, with particular expertise in designing and executing Design of Experiments (DOE).Exceptional verbal and written communication skills are essential for success in this role.PREFERRED:Comprehensive understanding of common mechanical commodities used in the semiconductor industry, including metals, plastics, rubbers, and adhesives is highly desirable.In-depth knowledge of manufacturing processes and tooling construction for mechanical commodities, including but not limited to CNC milling, stamping, bending, injection molding, die casting, and extrusion, will be viewed favorably.Superior self-motivation and self-direction, coupled with a demonstrated capacity for effective teamwork and strong intercultural competence.SKILLS:Advanced proficiency in quality management tools (FMEA, 8D, DMAIC) and statistical analysis software (JMP, Minitab).Expert-level proficiency in SolidWorks CAD software is required. Familiarity with SolidWorks Flow Simulation is a significant advantage.Extensive hands-on experience with technical equipment and processes, including advanced metrology and failure analysis techniques.Additional InformationSandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

Lead the mechanical development of SSD packaging by designing jigs, fixtures, and implementing rigorous engineering experiments. Oversee product qualification packages and drive cost reduction and root cause corrective action initiatives.